SCHEMBL9815889

SCHEMBL9815889

O=C(OC(=O)c1c(Cl)c(Cl)c(Cl)c(Cl)c1Cl)c1c(Cl)c(Cl)c(Cl)c(Cl)c1Cl

nearest known ligand 0.40

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.40
CES1 P23141 1/20 0.40
MEN1 O00255 1/20 0.30
ALDH1A1 P00352 1/20 0.30
LMNA P02545 1/20 0.30
MAPT P10636 1/20 0.30
HPGD P15428 1/20 0.30
TSHR P16473 1/20 0.30
KMT2A Q03164 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4364573 0.86 DPP4 (0.34) CES2CES1ALDH1A1HSD17B10
SCHEMBL7528694 0.82 CES2 (0.33) CES2CES1
SCHEMBL11146985 0.81 CES2 (0.40) CES2CES1MEN1ALDH1A1LMNA
SCHEMBL9815890 0.80 LMNA (0.50) CES2CES1ALDH1A1LMNAMAPT
SCHEMBL10594620 0.79 CES2 (0.44) CES2CES1
SCHEMBL8339188 0.77 CA12 (0.46) CES2CES1MEN1ALDH1A1LMNA
SCHEMBL11215185 0.77 CES2 (0.30) CES2CES1
SCHEMBL6740928 0.76 HTT (0.32) ALDH1A1HSD17B10
SCHEMBL7202434 0.75 CA12 (0.44) CES2CES1MEN1ALDH1A1LMNA
Dacthal SCHEMBL53477 0.73 CA12 (0.48) ALDH1A1LMNAMAPTHPGDTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114995060-B Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-114995060-A Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-114230792-A Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-03-25 CN claimed
CN-114995060-B Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN disclosed
CN-115236938-A Negative photosensitive polyamic acid ester resin composition and use thereof 明士(北京)新材料开发有限公司 2022-10-25 CN disclosed
CN-114995060-A Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN disclosed
CN-112175182-A Positive photosensitive polyesteramide resin and composition using same 明士(北京)新材料开发有限公司 2021-01-05 CN disclosed
CN-110808351-A Polyimide composite diaphragm of lithium ion power battery and preparation method thereof 贵州梅岭电源有限公司 2020-02-18 CN disclosed
EP-0261574-B1 CURABLE CROSS-LINKED POLYPHENYLENE ETHER INTERPENETRATING POLYMER NETWORK COMPOSITIONS AND PROCESS GENERAL ELECTRIC COMPANY (US) 1991-11-13 EP disclosed
EP-0264623-B1 CURABLE LINEAR POLYPHENYLENE ETHER INTERPENETRATING POLYMER NETWORK COMPOSITIONS AND PROCESS GENERAL ELECTRIC COMPANY (US) 1991-11-06 EP disclosed
EP-0264623-A2 Curable linear polyphenylene ether interpenetrating polymer network compositions and process GENERAL ELECTRIC COMPANY (US) 1988-04-27 EP disclosed
EP-0261574-A2 Curable cross-linked polyphenylene ether interpenetrating polymer network compositions and process GENERAL ELECTRIC COMPANY (US) 1988-03-30 EP disclosed
US-4263426-A HEATING THE CATALYST-FRES SOLUTION FROM THE LIQUID-PHASE OXIDATIVE POLYMERIZATION OF A MONOHYDRIC PHENOL CONTAINING A DIHYDRIC PHENOL AND REDUCING AGENT; AGITATION; STEAM DISTILLATION; ENGINEERING THERMOPLASTICS GENERAL ELECTRIC COMPANY (US) 1981-04-21 US disclosed
US-4165422-A Acyl capped quinone-coupled polyphenylene oxides GENERAL ELECTRIC COMPANY (US) 1979-08-21 US disclosed
US-4156773-A WITH A MONOACYL HALIDE, MONOSULFONYL HALIDE, ALKYL HALIDE, MONOCARBOXYLIC ACID ANHYDRIDE OR DIALKYL SULFATE GENERAL ELECTRIC COMPANY (US) 1979-05-29 US disclosed
US-4148843-A Compositions of capped polyphenylene oxides and alkenyl aromatic resins GENERAL ELECTRIC COMPANY (US) 1979-04-10 US disclosed
US-4048143-A WITH ACYL OR SULFONYL HALIDES, ANHYDRIDES OR DIALKYL SULFATES ON GENERAL ELECTRIC COMPANY (US) 1977-09-13 US disclosed