Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PLA2G7 | Q13093 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.31 |
| ▸ | RAB9A | P51151 | 2/20 | 0.31 |
| ▸ | NPC1 | O15118 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
| ▸ | XBP1 | P17861 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.31 |
| ▸ | PDE4A | P27815 | 1/20 | 0.31 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.31 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.31 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
| ▸ | STS | P08842 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18431386 | 1.00 | PLA2G7 (0.34) | PLA2G7MAPTKMT2ANPSR1ALDH1A1 | |
| SCHEMBL19594392 | 1.00 | PLA2G7 (0.34) | PLA2G7MAPTKMT2ANPSR1ALDH1A1 | |
| SCHEMBL14375148 | 0.94 | ALDH1A1 (0.33) | PLA2G7MAPTALDH1A1SMN1; SMN2POLB | |
| SCHEMBL2700595 | 0.89 | PLA2G7 (0.43) | PLA2G7MAPTNPSR1ALDH1A1MAPK1 | |
| SCHEMBL2700597 | 0.89 | PLA2G7 (0.43) | PLA2G7MAPTNPSR1ALDH1A1MAPK1 | |
| SCHEMBL46072 | 0.88 | SMN1; SMN2 (0.35) | PLA2G7KMT2AALDH1A1MAPK1SMN1; SMN2 | |
| SCHEMBL18720502 | 0.88 | SMN1; SMN2 (0.35) | PLA2G7KMT2AALDH1A1MAPK1SMN1; SMN2 | |
| SCHEMBL3378884 | 0.88 | SMN1; SMN2 (0.35) | PLA2G7KMT2AALDH1A1MAPK1SMN1; SMN2 | |
| SCHEMBL12923559 | 0.88 | SMN1; SMN2 (0.35) | PLA2G7KMT2AALDH1A1MAPK1SMN1; SMN2 | |
| SCHEMBL9891193 | 0.87 | PLA2G7 (0.34) | PLA2G7MAPTKMT2ANPC1MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 506 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| WO-2023162551-A1 | METHOD FOR PRODUCING PLATED SHAPED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023162552-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230229084-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-20 | — | — | US | disclosed |
| EP-3702387-B1 | PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-10 | — | — | EP | disclosed |
| EP-2980058-B1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-7419769-B2 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-09-02 | — | — | US | disclosed |
| US-20080193871-A1 | Positive Resist Composition For Immersion Exposure and Method of Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-08-14 | — | — | US | disclosed |
| EP-1947510-A1 | POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-07-23 | — | — | EP | disclosed |
| US-20080145784-A1 | Positive Resist Composition, Method For Resist Pattern Formation and Compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-06-19 | — | — | US | disclosed |
| US-20080131819-A1 | Process For Producing Resist Pattern and Conductor Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-06-05 | — | — | US | disclosed |
| US-20080090171-A1 | POSITIVE RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-04-17 | — | — | US | disclosed |
| US-20080032242-A1 | Method of Forming Plated Product Using Negative Photoresist Composition and Photosensitive Composition Used Therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-02-07 | — | — | US | disclosed |
| US-20080026321-A1 | Positive-working photoresist composition for thick film formation | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-01-31 | — | — | US | disclosed |
| US-20070275320-A1 | Chemically Amplified Photorestist Composition, Laminated Product, and Connection Element | HITACHI CONSTRUCTION MACHINERY CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| US-7169532-B2 | Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-01-30 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20080145784-A1 | Positive Resist Composition, Method For Resist Pattern Formation and Compound | POLR1A, POLR2A, POLR2B | PLA2G7 3023/4885MAPT 3002/4885KMT2A 2152/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.