SCHEMBL9926173

SCHEMBL9926173

COC1CC2CC1C1C(=O)OCC21

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 9/20 0.33
CYP2C9 P11712 5/20 0.33
CYP2D6 P10635 3/20 0.33
CYP2C19 P33261 5/20 0.32
MAPT P10636 4/20 0.32
LMNA P02545 4/20 0.32
MAPK1 P28482 3/20 0.32
HIF1A Q16665 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
NPC1 O15118 2/20 0.32
RAB9A P51151 2/20 0.32
TSHR P16473 2/20 0.32
TOP2A P11388 1/20 0.32
TP53 P04637 1/20 0.32
THPO P40225 1/20 0.32
ALDH1A1 P00352 1/20 0.32
NR3C1 P04150 1/20 0.32
TUBB4A P04350 1/20 0.32
TUBB P07437 1/20 0.32
TUBA3C P0DPH7 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13481214 0.86 CYP3A4 (0.33) CYP3A4CYP2C9CYP2D6CYP2C19MAPT
SCHEMBL45970 0.82 ALDH1A1 (0.31) SMN1; SMN2ALDH1A1
SCHEMBL13481234 0.82
SCHEMBL13481231 0.82
SCHEMBL12156893 0.81 LMNA (0.38) CYP3A4CYP2D6LMNA
SCHEMBL14397217 0.81
SCHEMBL4687089 0.80
SCHEMBL24996879 0.79
SCHEMBL5404648 0.79
SCHEMBL10195684 0.79 PPP5C (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11586111-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-21 US disclosed
US-11061326-B2 Chemical amplification type positive photosensitive resin composition, a photosensitive dry film, a method for producing a photosensitive dry film, a method for producing a patterned resist film, a method of manufacturing a template with a substrate, and a method of manufacturing a plated shaped product, and a Mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-07-13 US disclosed
US-20200174369-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-04 US disclosed
US-20190101825-A1 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, A PHOTOSENSITIVE DRY FILM, A METHOD FOR PRODUCING A PHOTOSENSITIVE DRY FILM, A METHOD FOR PRODUCING A PATTERNED RESIST FILM, A METHOD OF MANUFACTURING A TEMPLATE WITH A SUBSTRATE, AND A METHOD OF MANUFACTURING A PLATED SHAPED PRODUCT, AND A MERCAPTO COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2019-04-04 US disclosed
US-9829792-B2 Monomer, polymer, positive resist composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-11-28 US disclosed
US-20170008982-A1 MONOMER, POLYMER, POSITIVE RESIST COMPOSITION, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-12 US disclosed
US-9405197-B2 Pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-08-02 US disclosed
US-9134617-B2 Solvent developable negative resist composition, resist pattern formation method, and method for forming pattern of layer including block copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-15 US disclosed
US-20150160559-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-06-11 US disclosed
US-20150147702-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2015-05-28 US disclosed
US-20100233625-A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2010-09-16 US disclosed
US-20100209848-A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-19 US disclosed
US-20100167217-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-07-01 US disclosed
US-20100081088-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR INCLUDING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-01 US disclosed
US-20100062369-A1 Positive resist composition, method of forming resist pattern, and polymeric compound TOKYO OHKA KOGYO CO., LTD. (JP) 2010-03-11 US disclosed
US-7666571-B2 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-02-23 US disclosed
US-7666571-B2 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-02-23 US disclosed
US-20100015552-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR TOKYO OHKA KOGYO CO., LTD. (JP) 2010-01-21 US disclosed
US-20070099114-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-03 US disclosed
US-20070099114-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100081088-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR INCLUDING THE SAME ASIC1, RER1, GRIN1 CYP3A4 3282/4885CYP2C9 1630/4885CYP2D6 2238/4885
US-20170008982-A1 MONOMER, POLYMER, POSITIVE RESIST COMPOSITION, AND PATTERNING PROCESS PARG, PARN, MMS19 CYP3A4 4333/4885CYP2C9 4509/4885CYP2D6 4725/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.