SCHEMBL9975766

SCHEMBL9975766

CCN(CC)c1nc(N(COC)COC)nc(N(COC)COC)n1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.48
TSHR P16473 2/20 0.48
ALOX15 P16050 3/20 0.41
USP2 O75604 1/20 0.41
MAPT P10636 3/20 0.39
CRHR1 P34998 2/20 0.37
ALDH1A1 P00352 2/20 0.35
KDM4E B2RXH2 1/20 0.35
LMNA P02545 1/20 0.35
HPGD P15428 1/20 0.35
MAPK1 P28482 1/20 0.35
CASP1 P29466 1/20 0.35
CASP7 P55210 1/20 0.35
HSD17B10 Q99714 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
SLC29A1 Q99808 1/20 0.34
CA1 P00915 2/20 0.33
CA2 P00918 2/20 0.33
CA9 Q16790 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16844937 1.00 TDP1 (0.48) TDP1TSHRALOX15USP2MAPT
SCHEMBL16284299 0.98 TDP1 (0.47) TDP1TSHRALOX15USP2MAPT
SCHEMBL13202805 0.95 TDP1 (0.43) TDP1TSHRALOX15USP2MAPT
SCHEMBL13006380 0.95 TDP1 (0.48) TDP1TSHRALOX15USP2MAPT
SCHEMBL16638206 0.95 TDP1 (0.43) TDP1TSHRALOX15USP2MAPT
SCHEMBL2693585 0.93 TDP1 (0.45) TDP1TSHRALOX15USP2MAPT
SCHEMBL123963 0.90 ALDH1A1 (0.38) TDP1TSHRMAPTCRHR1ALDH1A1
SCHEMBL26134280 0.90 ALDH1A1 (0.38) TDP1TSHRMAPTCRHR1ALDH1A1
SCHEMBL18805573 0.86 MAPT (0.43) TDP1TSHRALOX15USP2MAPT
Formaldehyde SCHEMBL3821786 0.83 ALDH1A1 (0.34) TDP1TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
EP-3674350-B1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2021-11-24 EP disclosed
EP-3674350-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2020-07-01 EP disclosed
US-20180120702-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-03 US disclosed
US-20180112032-A1 CURED FILM FORMATION COMPOSITION, ORIENTATION MATERIAL, AND RETARDATION MATERIAL NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-04-26 US disclosed
US-20180024434-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-01-25 US disclosed
US-9862677-B2 Compound having polymerizable group and crosslinkable group and method for producing the same NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-01-09 US disclosed
US-9823401-B2 Cured film formation composition, orientation material, and retardation material NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-11-21 US disclosed
US-20170298186-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-19 US disclosed
US-20170255097-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-07 US disclosed
US-20160025915-A1 CURED FILM FORMATION COMPOSITION, ORIENTATION MATERIAL, AND RETARDATION MATERIAL NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-01-28 US disclosed
US-20150370166-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-12-24 US disclosed
US-8993699-B2 Photosensitive resin composition for microlens NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-03-31 US disclosed
US-8741509-B2 Colored curable composition, color filter, and method for producing color filter FUJIFILM CORPORATION (JP) 2014-06-03 US disclosed
US-8674043-B2 Photosensitive resin composition containing copolymer NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-03-18 US disclosed
US-8647810-B2 Resist lower layer film-forming composition, polymer, resist lower layer film, pattern-forming method, and method of producing semiconductor device JSR CORPORATION (JP) 2014-02-11 US disclosed
US-20120182638-A1 COLORED CURABLE COMPOSITION, COLOR FILTER, AND METHOD FOR PRODUCING COLOR FILTER FUJIFILM CORPORATION (JP) 2012-07-19 US disclosed
US-20120172557-A1 PHOTOSENSITIVE RESIN COMPOSITION CONTAINING COPOLYMER NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-07-05 US disclosed
US-20120156598-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR MICROLENS NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-06-21 US disclosed
US-20120077124-A1 RESIST LOWER LAYER FILM-FORMING COMPOSITION, POLYMER, RESIST LOWER LAYER FILM, PATTERN-FORMING METHOD, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2012-03-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20160025915-A1 CURED FILM FORMATION COMPOSITION, ORIENTATION MATERIAL, AND RETARDATION MATERIAL CCNA1, RAD51, SMC1A TDP1 3144/4885TSHR 4732/4885ALOX15 1238/4885
US-20180120702-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM TET1, KDM1A, KDM2B TDP1 1654/4885TSHR 3618/4885ALOX15 1533/4885
US-20180024434-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM F12, RTF1, PUF60 TDP1 1251/4885TSHR 2176/4885ALOX15 1611/4885
US-20170298186-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM ARCN1, COL1A1, F12 TDP1 1071/4885TSHR 4289/4885ALOX15 989/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.