SCHEMBL9988281

SCHEMBL9988281

Brc1c(Br)c(Br)c(Oc2ccccc2)c(Oc2ccccc2)c1Br

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 5/20 0.55
TSHR P16473 1/20 0.55
KDM4E B2RXH2 1/20 0.46
GLA P06280 1/20 0.46
MAPT P10636 1/20 0.46
KMT2A Q03164 1/20 0.46
NR1H2 P55055 1/20 0.42
BAX Q07812 1/20 0.42
MAOA P21397 1/20 0.42
CA1 P00915 2/20 0.38
CA2 P00918 2/20 0.38
CA12 O43570 1/20 0.38
CA7 P43166 1/20 0.38
CA13 Q8N1Q1 1/20 0.38
MAOB P27338 1/20 0.38
CA4 P22748 1/20 0.38
ALDH1A1 P00352 2/20 0.36
TDP1 Q9NUW8 1/20 0.36
HPGD P15428 1/20 0.36
RHEB Q15382 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49366 0.95 LTA4H (0.55) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL10592307 0.92 LTA4H (0.58) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL16890420 0.92 LTA4H (0.58) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL4016558 0.89 LTA4H (0.50) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL4010724 0.84 ALOX15 (0.49) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL6743011 0.83 LTA4H (0.42) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL21969982 0.81 LTA4H (0.46) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL17273646 0.80 LTA4H (0.73) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL11678987 0.80 LTA4H (0.41) LTA4HTSHRKDM4EGLAMAPT
SCHEMBL24043217 0.77 KDM4E (0.41) LTA4HTSHRKDM4EGLAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10233365-B2 Bond ply materials and circuit assemblies formed therefrom ROGERS CORPORATION (US) 2019-03-19 US claimed
WO-2017091491-A1 BOND PLY MATERIALS AND CIRCUIT ASSEMBLIES FORMED THEREFROM ROGERS CORPORATION (US) 2017-06-01 WO claimed
US-20170145266-A1 BOND PLY MATERIALS AND CIRCUIT ASSEMBLIES FORMED THEREFROM JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT 2017-05-25 US claimed
US-12234325-B2 Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board SHENGYI TECHNOLOGY CO., LTD. (CN) 2025-02-25 US disclosed
US-20220227942-A1 RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD SHENGYI TECHNOLOGY CO., LTD. (CN) 2022-07-21 US disclosed
CN-108368396-B Adhesive sheet material and circuit assembly formed therefrom 罗杰斯公司 2022-03-04 CN disclosed
CN-112513170-A Flame retardant polyolefin compositions 博里利斯股份公司 2021-03-16 CN disclosed
WO-2020237634-A1 RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD 广东生益科技股份有限公司 2020-12-03 WO disclosed
US-10233365-B2 Bond ply materials and circuit assemblies formed therefrom ROGERS CORPORATION (US) 2019-03-19 US disclosed
WO-2017091491-A1 BOND PLY MATERIALS AND CIRCUIT ASSEMBLIES FORMED THEREFROM ROGERS CORPORATION (US) 2017-06-01 WO disclosed
US-20170145266-A1 BOND PLY MATERIALS AND CIRCUIT ASSEMBLIES FORMED THEREFROM JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT 2017-05-25 US disclosed
CN-104087043-A Electric wire coating NI LIHENG 2014-10-08 CN disclosed
EP-2660278-A2 EPDM Foam and adhesive sealing material NITTO DENKO CORPORATION (JP) 2013-11-06 EP disclosed
EP-2392609-B1 Water and corrosion resistant EPDM foam and adhesive sealing material NITTO DENKO CORP (JP) 2013-07-31 EP disclosed
US-20120277337-A1 EPDM foam and adhesive sealing material NITTO DENKO CORPORATION (JP) 2012-11-01 US disclosed
EP-2392609-A1 Water and corrosion resistant EPDM foam and adhesive sealing material NITTO DENKO CORPORATION (JP) 2011-12-07 EP disclosed