SCHEMBL10033533

SCHEMBL10033533

CCC(C)C(=O)OCc1ccc(C#N)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 2/20 0.50
▸ TSHR P16473 1/20 0.47
▸ CYP2A6 P11509 1/20 0.46
▸ MAOB P27338 1/20 0.45
▸ GAA P10253 1/20 0.45
▸ TDP1 Q9NUW8 1/20 0.44
▸ MMP2 P08253 1/20 0.42
▸ MMP3 P08254 1/20 0.42
▸ CYP11B1 P15538 1/20 0.41
▸ CYP11B2 P19099 1/20 0.41
▸ ADRB2 P07550 1/20 0.41
▸ ADRB1 P08588 1/20 0.41
▸ ADRB3 P13945 1/20 0.41
▸ NPC1 O15118 1/20 0.40
▸ SMN1; SMN2 Q16637 1/20 0.40
▸ L3MBTL1 Q9Y468 1/20 0.40
▸ ADAMTS4 O75173 1/20 0.40
▸ MMP13 P45452 1/20 0.40
▸ SMPD1 P17405 1/20 0.40
▸ CHRNB2 P17787 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17694527 0.92 RAB9A (0.44) RAB9ATSHRCYP2A6MAOBGAA
SCHEMBL2742150 0.82 MEN1 (0.52) TSHRTDP1
SCHEMBL12116549 0.80 ALDH1A1 (0.45) RAB9AMAOBGAAMMP2NPC1
SCHEMBL12347973 0.80 MMP2 (0.50) RAB9AMAOBMMP2MMP3ADRB2
SCHEMBL10033505 0.79 MGLL (0.51) RAB9AMMP2MMP3CYP11B1CYP11B2
SCHEMBL12347968 0.79 ALDH1A1 (0.57) RAB9AMMP2MMP3MMP13
SCHEMBL24164305 0.79 LMNA (0.43) RAB9ATSHRADRB2ADRB1ADRB3
SCHEMBL15965769 0.79 MMP2 (0.48) MAOBGAAMMP2L3MBTL1
SCHEMBL12026774 0.79 CA1 (0.40) —
SCHEMBL13380665 0.79 KDM4E (0.48) MAOBGAATDP1SMN1; SMN2L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8202576-B2 Method of forming metal film FUJIFILM CORPORATION (JP) 2012-06-19 — — US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 — — US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 — — US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 — — US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 — — US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 — — US disclosed
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