SCHEMBL10033541

SCHEMBL10033541

CCC(C)C(=O)OC1CC2CC1CC2C#N

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
▸ HMGCR P04035 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23059482 0.85 — —
SCHEMBL12198853 0.79 HMGCR (0.35) HMGCR
SCHEMBL18403085 0.79 — —
SCHEMBL10049484 0.77 HMGCR (0.34) HMGCR
SCHEMBL18845275 0.77 HMGCR (0.34) HMGCR
SCHEMBL12198851 0.77 NAAA (0.33) —
SCHEMBL10224672 0.76 HMGCR (0.30) HMGCR
SCHEMBL12677510 0.75 HMGCR (0.31) HMGCR
SCHEMBL18253410 0.74 HMGCR (0.33) HMGCR
SCHEMBL2754977 0.74 DPP4 (0.30) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8501331-B2 Binder composition for magnetic recording medium and magnetic recording medium FUJIFILM CORPORATION (JP) 2013-08-06 — — US disclosed
US-8202576-B2 Method of forming metal film FUJIFILM CORPORATION (JP) 2012-06-19 — — US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 — — US disclosed
US-20110076517-A1 BINDER COMPOSITION FOR MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING MEDIUM FUJIFILM CORPORATION (JP) 2011-03-31 — — US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 — — US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 — — US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 — — US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 — — US disclosed
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