SCHEMBL10033554

SCHEMBL10033554

C=C(C)C(=O)NCCNC(=O)C(C)(C)CC

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
RIPK1 Q13546 4/20 0.41
DRD2 P14416 2/20 0.36
DRD4 P21917 2/20 0.36
CNR1 P21554 1/20 0.31
EPHX1 P07099 1/20 0.31
TGFBR1 P36897 1/20 0.31
POLB P06746 2/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12716899 0.90 RIPK1 (0.37) RIPK1DRD2DRD4
SCHEMBL16256504 0.89 TSHR (0.43) RIPK1DRD2DRD4
SCHEMBL16256501 0.86 RIPK1 (0.35) RIPK1DRD2DRD4
SCHEMBL16256506 0.85 THRB (0.35) RIPK1DRD2DRD4EPHX1POLB
SCHEMBL16256499 0.85 DRD2 (0.36) RIPK1DRD2DRD4CNR1EPHX1
SCHEMBL14153992 0.84 RIPK1 (0.52) RIPK1DRD2DRD4CNR1EPHX1
SCHEMBL14486557 0.80 RIPK1 (0.46) RIPK1DRD2DRD4CNR1EPHX1
SCHEMBL316224 0.79 TGFBR1 (0.41) TGFBR1
SCHEMBL10065760 0.79 POLB (0.34) TGFBR1POLB
SCHEMBL20100319 0.79 RIPK1 (0.41) RIPK1DRD2DRD4TGFBR1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9690195-B2 Lithographic printing plate precursors and processes for preparing lithographic printing plates FUJIFILM CORPORATION (JP) 2017-06-27 US disclosed
US-20150044612-A1 LITHOGRAPHIC PRINTING PLATE PRECURSORS AND PROCESSES FOR PREPARING LITHOGRAPHIC PRINTING PLATES FUJIFILM CORPORATION (JP) 2015-02-12 US disclosed
US-8714088-B2 Lithographic printing plate precursor and lithographic printing method FUJIFILM CORPORATION (JP) 2014-05-06 US disclosed
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-8202576-B2 Method of forming metal film FUJIFILM CORPORATION (JP) 2012-06-19 US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100071828-A1 METHOD OF PRODUCING MULTILAYER STRUCTURE FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed
US-20090114108-A1 LITHOGRAPHIC PRINTING PLATE PRECURSOR AND LITHOGRAPHIC PRINTING METHOD FUJIFILM CORPORATION (JP) 2009-05-07 US disclosed