SCHEMBL10077436

SCHEMBL10077436

CC(C)(C)CC(c1ccc(Cl)cc1)C(C)(C)C

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A4 P31645 4/20 0.43
SLC6A3 Q01959 3/20 0.43
SLC6A2 P23975 3/20 0.43
TSHR P16473 2/20 0.40
MAPK1 P28482 2/20 0.40
HIF1A Q16665 2/20 0.40
TDP1 Q9NUW8 2/20 0.40
LMNA P02545 2/20 0.40
TP53 P04637 1/20 0.40
HPGD P15428 1/20 0.40
ADRB2 P07550 1/20 0.40
AOC3 Q16853 2/20 0.39
HTR2A P28223 1/20 0.36
HRH1 P35367 1/20 0.36
HTR2B P41595 1/20 0.36
CHRNA4 P43681 1/20 0.36
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
BRD4 O60885 1/20 0.34
FFAR2 O15552 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14317673 0.84 MAOB (0.51) MAPK1MEN1KMT2A
SCHEMBL29293451 0.80 ESR1 (0.31) TSHRMAPK1TDP1
SCHEMBL19184276 0.79 RIPK1 (0.33) SLC6A4SLC6A3SLC6A2AOC3
SCHEMBL12361680 0.79 AOC3 (0.39) SLC6A4SLC6A3SLC6A2MAPK1LMNA
SCHEMBL784711 0.79 ESR1 (0.44) SLC6A4SLC6A3SLC6A2TSHRHIF1A
SCHEMBL12646169 0.79
SCHEMBL12361552 0.79 ALDH1A1 (0.38) LMNAHPGDHTR2AMEN1KMT2A
SCHEMBL11960807 0.79 ESR1 (0.44) SLC6A4SLC6A3SLC6A2TSHRHIF1A
SCHEMBL13702479 0.79 ALDH1A1 (0.35) TSHRMAPK1TDP1HPGDMEN1
SCHEMBL14646064 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023054126-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN-FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-04-06 WO disclosed
US-11231650-B2 Chemically amplified negative resist composition and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-01-25 US disclosed
US-11131926-B2 Resist composition and resist patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-09-28 US disclosed
US-10725377-B2 Chemically amplified negative resist composition and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-07-28 US disclosed
US-20200133121-A1 ONIUM SALT, NEGATIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-04-30 US disclosed
EP-2492746-B1 Chemically amplified negative resist composition and patterning process SHINETSU CHEMICAL CO (JP) 2019-11-20 EP disclosed
US-20180180998-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-06-28 US disclosed
EP-3081987-B1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION USING NOVEL ONIUM SALT AND RESIST PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2018-06-06 EP disclosed
US-9969829-B2 Polymer compound, negative resist composition, laminate, patterning process, and compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-15 US disclosed
US-20180039175-A1 NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-08 US disclosed
US-9740098-B2 Chemically amplified negative resist composition using novel onium salt and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-08-22 US disclosed
EP-2360526-B1 Chemically amplified negative resist composition for E beam or EUV lithography and patterning process SHINETSU CHEMICAL CO (JP) 2017-08-16 EP disclosed
US-20170210836-A1 POLYMER COMPOUND, NEGATIVE RESIST COMPOSITION, LAMINATE, PATTERNING PROCESS, AND COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-27 US disclosed
US-9645493-B2 Negative resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-09 US disclosed
EP-2362267-B1 Chemically amplified negative resist composition and patterning process SHINETSU CHEMICAL CO (JP) 2013-01-23 EP disclosed
EP-2492746-A2 Chemically amplified negative resist composition and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2012-08-29 EP disclosed
EP-2412733-A1 Polymer, chemically amplified negative resist composition, and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2012-02-01 EP disclosed
EP-2362267-A1 Chemically amplified negative resist composition and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2011-08-31 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200133121-A1 ONIUM SALT, NEGATIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS SLC6A5, SLC11A2, LARP7 SLC6A4 772/4885SLC6A3 1341/4885SLC6A2 464/4885
US-20180180998-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SLC11A2, POLR2B, POLI SLC6A4 2512/4885SLC6A3 4060/4885SLC6A2 3049/4885
US-10725377-B2 Chemically amplified negative resist composition and resist pattern forming process SLC11A2, POLR2B, POLI SLC6A4 2512/4885SLC6A3 4060/4885SLC6A2 3049/4885
US-11131926-B2 Resist composition and resist patterning process SLC11A2, RER1, GPS1 SLC6A4 3247/4885SLC6A3 2949/4885SLC6A2 3004/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.