SCHEMBL10165568

SCHEMBL10165568

COc1ccc2c(c1)[nH]c1cc(Br)ccc12

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDK4 P11802 2/20 0.61
CCND1 P24385 2/20 0.61
KDM4E B2RXH2 6/20 0.55
ALDH1A1 P00352 5/20 0.55
HSD17B10 Q99714 4/20 0.55
MEN1 O00255 2/20 0.55
MAPT P10636 2/20 0.55
KMT2A Q03164 2/20 0.55
GFER P55789 2/20 0.55
TSHR P16473 1/20 0.55
HPGD P15428 4/20 0.51
RXFP1 Q9HBX9 1/20 0.51
DYRK1A Q13627 5/20 0.50
SMN1; SMN2 Q16637 2/20 0.50
CYP1A2 P05177 2/20 0.50
CYP3A4 P08684 2/20 0.50
CYP2D6 P10635 2/20 0.50
ADRA2A P08913 2/20 0.50
ADRA2B P18089 2/20 0.50
ADRA2C P18825 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6972469 0.91 KDM4E (0.70) CDK4CCND1KDM4EALDH1A1HSD17B10
SCHEMBL31188767 0.91 KDM4E (0.65) CDK4CCND1KDM4EALDH1A1HSD17B10
SCHEMBL22633747 0.91 KDM4E (0.65) CDK4CCND1KDM4EALDH1A1HSD17B10
SCHEMBL29533596 0.88 KDM4E (0.68) CDK4CCND1KDM4EALDH1A1HSD17B10
SCHEMBL2330779 0.88 KDM4E (0.68) CDK4CCND1KDM4EALDH1A1HSD17B10
SCHEMBL7669097 0.82 ABCG2 (0.68) CDK4CCND1KDM4EALDH1A1HSD17B10
Ethane SCHEMBL29122859 0.82 METAP2 (0.48) ALDH1A1HPGDCCNB2CDK1CCNB1
SCHEMBL29397381 0.82 METAP2 (0.52) CDK4CCND1CCNT1CCNB2CDK1
SCHEMBL181890 0.82 METAP2 (0.52) CDK4CCND1CCNT1CCNB2CDK1
SCHEMBL28272924 0.82 METAP2 (0.52) CDK4CCND1CCNT1CCNB2CDK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4025643-B1 THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT BASF SE (DE) 2023-08-16 EP claimed
US-20220315738-A1 THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT BASF SE (DE) 2022-10-06 US claimed
EP-4025643-A1 THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT BASF SE (DE) 2022-07-13 EP claimed
CN-114341266-A Heat-resistant thermoplastic moulding materials 巴斯夫欧洲公司 2022-04-12 CN claimed
WO-2021043859-A1 THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT BASF SE (DE) 2021-03-11 WO claimed
US-20250201546-A1 METHOD FOR PROCESSING SUBSTRATE, KIT FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-19 US disclosed
US-20250140548-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD, (JP) 2025-05-01 US disclosed
US-20250140549-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD, (JP) 2025-05-01 US disclosed
US-20250084351-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-03-13 US disclosed
CN-117603266-A Hole transport material containing benzoheterocycle structure and application thereof 隆基绿能科技股份有限公司 2024-02-27 CN disclosed
EP-4025643-B1 THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT BASF SE (DE) 2023-08-16 EP disclosed
US-20230146233-A1 A CLASS OF POLYCYCLIC COMPOUNDS INHIBITING RNA HELICASE DHX33 AND THE APPLICATION THEREOF SHENZHEN KEYE LIFE TECHNOLOGIES, CO., LTD (CN) 2023-05-11 US disclosed
CN-112898284-B Compound for inhibiting RNA helicase DHX33 and application thereof 深圳开悦生命科技有限公司 2022-06-21 CN disclosed
CN-114341266-A Heat-resistant thermoplastic moulding materials 巴斯夫欧洲公司 2022-04-12 CN disclosed
CN-112898284-A Compound for inhibiting RNA helicase DHX33 and application thereof 深圳开悦生命科技有限公司 2021-06-04 CN disclosed
WO-2021043859-A1 THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT BASF SE (DE) 2021-03-11 WO disclosed
EP-2439803-B1 PHOTOELECTRIC CONVERSION ELEMENT AND METHOD FOR PRODUCING SAME, PHOTOSENSOR, IMAGING ELEMENT AND METHOD OF DRIVING SAME FUJIFILM CORP (JP) 2017-11-08 EP disclosed
US-20150129861-A1 ORGANIC MATERIAL FOR DEPOSITION, AND ORGANIC PHOTOELECTRIC CONVERSION ELEMENT, IMAGING ELEMENT, DEPOSITION METHOD, AND MANUFACTURING METHOD FOR ORGANIC PHOTOELECTRONIC ONVERSION ELEMENT OBTAINED USING THE SAME FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-8847141-B2 Photoelectric conversion element, production method thereof, photosensor, imaging device and their driving method FUJIFILM CORPORATION (JP) 2014-09-30 US disclosed
US-20120080585-A1 PHOTOELECTRIC CONVERSION ELEMENT, PRODUCTION METHOD THEREOF, PHOTOSENSOR, IMAGING DEVICE AND THEIR DRIVING METHOD FUJIFILM CORPORATION (JP) 2012-04-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120080585-A1 PHOTOELECTRIC CONVERSION ELEMENT, PRODUCTION METHOD THEREOF, PHOTOSENSOR, IMAGING DEVICE AND THEIR DRIVING METHOD SUN2, CYBA, PPOX CDK4 2248/4885CCND1 4091/4885KDM4E 169/4885
US-20230146233-A1 A CLASS OF POLYCYCLIC COMPOUNDS INHIBITING RNA HELICASE DHX33 AND THE APPLICATION THEREOF DHX36, DDX21, DDX3X CDK4 3287/4885CCND1 3856/4885KDM4E 2120/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.