SCHEMBL10487592

SCHEMBL10487592

Cc1cc(C(C)(C)C)c(-c2ccc(C(C)(C)C)c(OCC(CO)(CO)CO)c2C(C)(C)C)c(C(C)(C)C)c1

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.33
ALDH1A1 P00352 1/20 0.33
CA2 P00918 1/20 0.33
POLB P06746 1/20 0.33
TYR P14679 1/20 0.33
ALOX15 P16050 3/20 0.32
HSPA5 P11021 1/20 0.31
CYP2C9 P11712 1/20 0.31
CYP2C19 P33261 1/20 0.31
HIF1A Q16665 1/20 0.31
CNR1 P21554 1/20 0.30
CNR2 P34972 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8962428 0.79 ALOX15 (0.34) ALDH1A1ALOX15
SCHEMBL2232697 0.79 SMN1; SMN2 (0.44) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL7947269 0.78 SMN1; SMN2 (0.33) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL3106078 0.75 CYP2D6 (0.43) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL28610704 0.75 CYP2D6 (0.43) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL28706484 0.72 CYP2D6 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL27889673 0.71 CA2 (0.42) SMN1; SMN2ALDH1A1CA2
Pyrophosphoric Acid SCHEMBL5181896 0.69 HSPA5 (0.36) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL2163492 0.69 SMN1; SMN2 (0.32) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL28979480 0.69 ALDH1A1 (0.50) SMN1; SMN2ALDH1A1CA2CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110964316-B Polyamide composition, molded article, and semi-aromatic polyamide 旭化成株式会社 2023-02-17 CN disclosed
US-20160215124-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING THE RESIN MOLDED ARTICLE WITH PLATING LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2016-07-28 US disclosed
US-4888371-A HEAT RESISTANCE, LIGHT RESISTANCE ADEKA ARGUS CHEMICAL CO., LTD. (JP) 1989-12-19 US disclosed
EP-0143464-B1 PENTAERYTHRITOL-SPIRO-BIS-PHOSPHITE COMPOSITIONS HAVING IMPROVED HYDROLYTIC STABILITY Argus Chemical Corporation (US) 1987-07-08 EP disclosed
EP-0143464-A2 Pentaerythritol-spiro-bis-phosphite compositions having improved hydrolytic stability Argus Chemical Corporation (US) 1985-06-05 EP disclosed
US-4371647-A 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resin ADEKA ARGUS CHEMICAL CO. LTD. (JP) 1983-02-01 US disclosed
EP-0038876-A1 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resins, stabilizer compositions comprising phenolic antioxidants and such phosphites, and synthetic resin compositions containing the same ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1981-11-04 EP disclosed