Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.33 |
| ▸ | CD81 | P60033 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.30 |
| ▸ | GLA | P06280 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL596454 | 0.83 | CD81 (0.34) | THRBCYP2C9CD81MAPTEPHX1 | |
| SCHEMBL6559871 | 0.81 | THRB (0.32) | THRBCYP2C9CD81 | |
| SCHEMBL1088145 | 0.80 | HSD11B1 (0.32) | — | |
| SCHEMBL3207202 | 0.80 | CD81 (0.32) | THRBCYP2C9CD81 | |
| SCHEMBL595458 | 0.80 | CD81 (0.32) | THRBCYP2C9CD81 | |
| SCHEMBL28732515 | 0.73 | CD81 (0.35) | THRBCYP2C9CD81 | |
| SCHEMBL10322379 | 0.72 | GLA (0.30) | THRBCYP2C9GLA | |
| SCHEMBL9649905 | 0.71 | HSD11B1 (0.38) | THRBCYP2C9MAPT | |
| SCHEMBL244479 | 0.71 | HSD11B1 (0.38) | THRBCYP2C9MAPT | |
| SCHEMBL9929189 | 0.69 | NPSR1 (0.33) | CD81 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10670965-B2 | Polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-06-02 | — | — | US | claimed |
| US-9983477-B2 | Polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-05-29 | — | — | US | claimed |
| EP-2527380-B1 | Photosensitive compositions | ROHM & HAAS ELECT MAT (US) | 2013-12-18 | — | — | EP | claimed |
| US-8507176-B2 | Photosensitive compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-08-13 | — | — | US | claimed |
| EP-2341089-B1 | Photosensitive compositions | ROHM & HAAS ELECT MAT (US) | 2013-02-13 | — | — | EP | claimed |
| US-20110236823-A1 | NOVEL POLYMERS AND PHOTORESIST COMPOSITIONS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-29 | — | — | US | claimed |
| EP-2341089-A1 | Photosensitive compositions | Rohm and Haas Electronic Materials LLC (US) | 2011-07-06 | — | — | EP | claimed |
| US-20110159429-A1 | PHOTOSENSITIVE COMPOSITIONS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-06-30 | — | — | US | claimed |
| US-7838199-B2 | Polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2010-11-23 | — | — | US | claimed |
| US-20080206671-A1 | Novel polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-08-28 | — | — | US | claimed |
| US-10670965-B2 | Polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-06-02 | — | — | US | disclosed |
| EP-2597518-B1 | Compositions and antireflective coatings for photolithography | DOW GLOBAL TECHNOLOGIES LLC (US) | 2016-12-07 | — | — | EP | disclosed |
| US-9011591-B2 | Compositions and antireflective coatings for photolithography | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-04-21 | — | — | US | disclosed |
| US-8557501-B2 | Developable bottom antireflective coating compositions especially suitable for ion implant applications | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-10-15 | — | — | US | disclosed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| US-7192682-B2 | Unsaturated monomers, polymers, chemically-amplified resist composition, and process of pattern formation | NEC CORPORATION (JP) | 2007-03-20 | — | — | US | disclosed |
| US-20040265732-A1 | Unsaturated monomers, polymers, chemically amplified resist composition, and process of pattern formation | NEC CORPORATION (JP) | 2004-12-30 | — | — | US | disclosed |
| CN-1550896-A | Processes for preparing photoresist compositions and the product | ��Ļ���Ű˾ | 2004-12-01 | — | — | CN | disclosed |