Salicylic Acid

Salicylic Acid

SCHEMBL109218

O=C([O-])c1ccccc1O.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.70

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHE

The experimentally established mechanism targets of Salicylic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 8/20 0.70
HPGD P15428 7/20 0.70
ALDH1A1 P00352 4/20 0.70
SMN1; SMN2 Q16637 3/20 0.52
CA12 O43570 1/20 0.52
CA1 P00915 1/20 0.52
CA2 P00918 1/20 0.52
HMGB1 P09429 1/20 0.52
CA4 P22748 1/20 0.52
CA6 P23280 1/20 0.52
CA7 P43166 1/20 0.52
CA9 Q16790 1/20 0.52
NAPRT Q6XQN6 1/20 0.52
CA14 Q9ULX7 1/20 0.52
HSD17B10 Q99714 4/20 0.45
MAPT P10636 3/20 0.45
TSHR P16473 3/20 0.45
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
NPC1 O15118 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Salicylic Acid SCHEMBL516279 0.93 HPGD (0.61) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Phthalic Acid SCHEMBL107074 0.88 ALDH1A1 (0.50) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL5450889 0.86 KDM4E (0.95) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL6249450 0.85 KDM4E (0.95) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL23795260 0.84 HPGD (0.83) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL31140000 0.84 HPGD (0.83) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL27974441 0.84 HPGD (0.83) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL31140005 0.84 HPGD (0.83) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL10669448 0.84 HPGD (0.83) KDM4EHPGDALDH1A1SMN1; SMN2CA12
Salicylic Acid SCHEMBL455422 0.83 KDM4E (1.00) KDM4EHPGDALDH1A1SMN1; SMN2CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 604 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250377590-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN JSR CORPORATION (JP) 2025-12-11 US claimed
US-12422748-B2 Radiation-sensitive resin composition and method for forming resist pattern JSR CORPORATION (JP) 2025-09-23 US claimed
US-20230341772-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN JSR CORPORATION (JP) 2023-10-26 US claimed
US-11747725-B2 Radiation-sensitive resin composition and method for forming resist pattern JSR CORPORATION (JP) 2023-09-05 US claimed
US-20140363773-A1 PATTERN-FORMING METHOD JSR CORPORATION (JP) 2014-12-11 US claimed
US-20120156621-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2012-06-21 US claimed
WO-2026100410-A1 IODINE-CONTAINING POLYMERIZABLE COMPOUND AND IODINE-CONTAINING POLYMER 三菱瓦斯化学株式会社 2026-05-15 WO disclosed
US-20260118767-A1 REVERSE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-30 US disclosed
US-20260079396-A1 RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN AND ONIUM SALT COMPOUND JSR CORPORATION (JP) 2026-03-19 US disclosed
US-20260063994-A1 RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN AND ONIUM SALT COMPOUND JSR CORPORATION (JP) 2026-03-05 US disclosed
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-12 US disclosed
EP-4692941-A2 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
US-12516074-B2 Composition, film, method of forming film, method of forming pattern, method of forming organic-underlayer-film reverse pattern, and method of producing composition JSR CORPORATION (JP) 2026-01-06 US disclosed
US-20040143082-A1 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed
EP-1398339-A1 POLYSILOXANE, PROCESS FOR PRODUCTION THEREOF AND RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-03-17 EP disclosed
US-20030170561-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2003-09-11 US disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed
US-6468714-B2 FINE PHOTORESIST PATTERNS JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010006758-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2001-07-05 US disclosed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (8 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230341772-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN RER1, XRCC5, F12 KDM4E 2313/4885HPGD 1741/4885ALDH1A1 2075/4885
US-20260079396-A1 RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN AND ONIUM SALT COMPOUND SRMS, RAD1, SLC11A2 KDM4E 2460/4885HPGD 4137/4885ALDH1A1 3009/4885
US-11747725-B2 Radiation-sensitive resin composition and method for forming resist pattern RER1, AFF1, RAD51 KDM4E 3805/4885HPGD 1167/4885ALDH1A1 2008/4885
US-12422748-B2 Radiation-sensitive resin composition and method for forming resist pattern RER1, XRCC5, F12 KDM4E 2301/4885HPGD 1739/4885ALDH1A1 2058/4885
US-20260118767-A1 REVERSE PATTERNING PROCESS EFNA1, EPHA4, ETV6 KDM4E 588/4885HPGD 4878/4885ALDH1A1 4452/4885
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SMC1A, SPOUT1, LBR KDM4E 2013/4885HPGD 4586/4885ALDH1A1 1558/4885
US-20260063994-A1 RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN AND ONIUM SALT COMPOUND RAD1, RPA1, RAD51 KDM4E 4262/4885HPGD 3920/4885ALDH1A1 274/4885
US-20250377590-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN RER1, RAD51, RFC2 KDM4E 3336/4885HPGD 1341/4885ALDH1A1 625/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.