SCHEMBL1099458

SCHEMBL1099458

O=C(O)c1cc(F)c(-c2cc(C(=O)O)c(C(=O)O)cc2F)cc1C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 2/20 0.48
NFE2L2 Q16236 1/20 0.48
KDM4E B2RXH2 2/20 0.43
ASPH Q12797 1/20 0.43
KDM8 Q8N371 1/20 0.43
ALDH1A1 P00352 3/20 0.43
ALB P02768 2/20 0.43
ACMSD Q8TDX5 2/20 0.43
TTR P02766 2/20 0.43
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
MEN1 O00255 1/20 0.43
USP2 O75604 1/20 0.43
DHFR P00374 1/20 0.43
LMNA P02545 1/20 0.43
HMGB1 P09429 1/20 0.43
HPGD P15428 1/20 0.43
CXCL12 P48061 1/20 0.43
KMT2A Q03164 1/20 0.43
HIF1A Q16665 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4830274 0.86 KEAP1 (0.54) KEAP1NFE2L2KDM4EASPHKDM8
SCHEMBL29045470 0.83 KEAP1 (0.52) KEAP1NFE2L2KDM4EASPHKDM8
Lithium SCHEMBL30497778 0.83 KEAP1 (0.52) KEAP1NFE2L2KDM4EASPHKDM8
SCHEMBL1713733 0.80 KDM4E (0.54) KEAP1NFE2L2KDM4EASPHKDM8
Boric Acid SCHEMBL29160818 0.79 KEAP1 (0.48) KEAP1NFE2L2KDM4EASPHKDM8
SCHEMBL9847400 0.77 KEAP1 (0.47) KEAP1NFE2L2KDM4EASPHKDM8
SCHEMBL31169210 0.77 KEAP1 (0.47) KEAP1NFE2L2KDM4EASPHKDM8
Pyromellitic Acid SCHEMBL28093100 0.76 ALDH1A1 (0.50) KEAP1NFE2L2KDM4EALDH1A1CA1
SCHEMBL363928 0.76 KEAP1 (0.50) KEAP1NFE2L2KDM4EASPHKDM8
SCHEMBL31258575 0.76 KEAP1 (0.50) KEAP1NFE2L2KDM4EASPHKDM8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0698052-B1 NEGATIVE BIREFRINGENT POLYIMIDE FILMS UNIV AKRON (US) 2000-06-14 EP claimed
US-5480964-A CONTROLLING ORIENTATION BY SUBSTITUTION ON AROMATIC BACKBONE THE UNIVERSITY OF AKRON (US) 1996-01-02 US claimed
US-5395918-A Heat resistance, electrical resistance and mechanical properties THE UNIVERSITY OF AKRON (US) 1995-03-07 US claimed
CN-114174422-A Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board DIC株式会社 2022-03-11 CN disclosed
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-3819283-A1 METHOD FOR PRODUCING ORGANIC COMPOUND Unitika Ltd. (JP) 2021-05-12 EP disclosed
WO-2021039111-A1 RESIN COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL USING SAME, IMPREGNATED BASE MATERIAL, CIRCUIT BASE BOARD, BUILD-UP FILM, PREPREG, CARBON FIBER COMPOSITE MATERIAL, SOLDER RESIST, DRY FILM, AND PRINTED CIRCUIT BOARD DIC株式会社 2021-03-04 WO disclosed
EP-2530103-A1 POLYIMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE EACH COMPRISING SAME, AND DEVICE Mitsui Chemicals, Inc. (JP) 2012-12-05 EP disclosed
US-20120295085-A1 POLYMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE EACH COMPRISING SAME, AND DEVICE MITSUI CHEMICALS, INC. (JP) 2012-11-22 US disclosed
US-20120126393-A1 RESIN COMPOSITION, MULTILAYER BODY CONTAINING THE SAME, SEMICONDUCTOR DEVICE, AND FILM MITSUI CHEMICALS, INC. (JP) 2012-05-24 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-20030092870-A1 Novel aromatic diamine and polyimide thereof MITSUI CHEMICALS, INC. (JP) 2003-05-15 US disclosed
EP-1288191-A2 Novel aromatic diamine and polyimide thereof Mitsui Chemicals, Inc. (JP) 2003-03-05 EP disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed
US-6183934-B1 FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE KABUSHIKI KAISHA TOSHIBA (JP) 2001-02-06 US disclosed
US-6159654-A Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating KABUSHIKI KAISHA TOSHIBA (JP) 2000-12-12 US disclosed
US-6001517-A A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-14 US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 US disclosed
US-5578697-A DIELECTRIC POLYMERS FOR ELECTRONICS KABUSHIKI KAISHA TOSHIBA (JP) 1996-11-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030092870-A1 Novel aromatic diamine and polyimide thereof DDT, AOC1, H1-4 KEAP1 1885/4885NFE2L2 1926/4885KDM4E 228/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.