SCHEMBL1100208

SCHEMBL1100208

O=C(O)c1c(C(=O)O)c(C(F)(F)F)c(C(F)(F)F)c(-c2c(C(F)(F)F)c(C(=O)O)c(C(=O)O)c(C(F)(F)F)c2C(F)(F)F)c1C(F)(F)F

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
GPR35 Q9HC97 1/20 0.33
TSHR P16473 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
RXRA P19793 1/20 0.31
RXRB P28702 1/20 0.31
RXRG P48443 1/20 0.31
DAO P14920 1/20 0.30
SRD5A2 P31213 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1634950 0.87 GPR35 (0.36) GPR35TSHRSMN1; SMN2RXRARXRB
SCHEMBL436571 0.84 GPR35 (0.38) GPR35TSHRSMN1; SMN2RXRARXRB
SCHEMBL9142308 0.84 GPR35 (0.38) GPR35TSHRSMN1; SMN2RXRARXRB
Hydrochloric Acid SCHEMBL9344466 0.81 GPR35 (0.36) GPR35TSHRSMN1; SMN2RXRARXRB
SCHEMBL31244452 0.81 GPR35 (0.36) GPR35TSHRSMN1; SMN2RXRARXRB
SCHEMBL2693183 0.78 ALDH1A1 (0.30) GPR35TSHRSMN1; SMN2
SCHEMBL31542027 0.77 SMN1; SMN2 (0.41) GPR35TSHRSMN1; SMN2RXRARXRB
SCHEMBL14322147 0.75 SMN1; SMN2 (0.39) GPR35TSHRSMN1; SMN2RXRARXRB
SCHEMBL28995828 0.73 FABP4 (0.41) RXRARXRBRXRG
SCHEMBL22115216 0.70 SMN1; SMN2 (0.44) GPR35TSHRSMN1; SMN2RXRARXRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120126393-A1 RESIN COMPOSITION, MULTILAYER BODY CONTAINING THE SAME, SEMICONDUCTOR DEVICE, AND FILM MITSUI CHEMICALS, INC. (JP) 2012-05-24 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-7851121-B2 Photosensitive polyimide composition and polyimide precursor composition CENTRAL GLASS CO., LTD. (JP) 2010-12-14 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed
US-20090176172-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION CENTRAL GLASS CO., LTD. (JP) 2009-07-09 US disclosed
US-20090035541-A1 Metal laminate, method for manufacturing same and use thereof MITSUI CHEMICALS, INC. (JP) 2009-02-05 US disclosed
US-20080268266-A1 Polyimide Metal Laminate and Suspension for Hard Disk Using Same MITSUI CHEMICALS, INC. (JP) 2008-10-30 US disclosed
US-6933411-B2 Aromatic diamine and polyimide thereof MITSUI CHEMICALS, INC. (JP) 2005-08-23 US disclosed
US-6737503-B2 LOW TEMPERATURE ADHESIVE BONDING MITSUI CHEMICALS, INC. (JP) 2004-05-18 US disclosed
US-20040082754-A1 Novel aromatic diamine and polyimide thereof MITSUI CHEMICALS, INC. (JP) 2004-04-29 US disclosed
US-20030092870-A1 Novel aromatic diamine and polyimide thereof MITSUI CHEMICALS, INC. (JP) 2003-05-15 US disclosed
EP-1288191-A2 Novel aromatic diamine and polyimide thereof Mitsui Chemicals, Inc. (JP) 2003-03-05 EP disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed
US-6183934-B1 FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE KABUSHIKI KAISHA TOSHIBA (JP) 2001-02-06 US disclosed
US-6001517-A A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-14 US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 US disclosed
US-5578697-A DIELECTRIC POLYMERS FOR ELECTRONICS KABUSHIKI KAISHA TOSHIBA (JP) 1996-11-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030092870-A1 Novel aromatic diamine and polyimide thereof DDT, AOC1, H1-4 GPR35 3791/4885TSHR 3434/4885SMN1; SMN2 2287/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.