Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NAAA | Q02083 | 1/20 | 0.53 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
| ▸ | DGKA | P23743 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | RAD52 | P43351 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | FAAH | O00519 | 1/20 | 0.33 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | HTR2C | P28335 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 4/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
| ▸ | BLM | P54132 | 1/20 | 0.32 |
| ▸ | WRN | Q14191 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28379557 | 0.89 | NAAA (0.47) | NAAAHTTDGKAGAAALDH1A1 | |
| SCHEMBL31124882 | 0.88 | NAAA (0.47) | NAAAHTTDGKAGAAALDH1A1 | |
| SCHEMBL5164186 | 0.86 | ADRA2A (0.43) | NAAADGKALMNADNM1MEN1 | |
| SCHEMBL13303712 | 0.85 | FAAH (0.44) | NAAADGKALMNAGAARAD52 | |
| SCHEMBL6271674 | 0.85 | DGKA (0.46) | NAAADGKALMNAALDH1A1RAD52 | |
| SCHEMBL5159381 | 0.84 | DGKA (0.48) | NAAADGKAALDH1A1DNM1HTR2C | |
| SCHEMBL4683111 | 0.84 | NAAA (0.35) | NAAADGKALMNAALDH1A1RAD52 | |
| SCHEMBL4358005 | 0.83 | DGKA (0.53) | NAAADGKALMNAALDH1A1RAD52 | |
| SCHEMBL180594 | 0.82 | HTR2C (0.39) | NAAADGKALMNARAD52NPSR1 | |
| SCHEMBL20480731 | 0.82 | NAAA (0.34) | NAAADGKALMNARAD52NPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108383874-A | The method for being used to prepare acylphosphanes | 瑞士联邦苏黎世技术大学 | 2018-08-10 | — | — | CN | claimed |
| CN-109791222-B | Transparent substrate having anti-glare and anti-reflection properties and method for manufacturing same | 福美化学工业株式会社 | 2020-12-29 | — | — | CN | disclosed |
| EP-2963088-B1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY | LINTEC CORP (JP) | 2020-06-10 | — | — | EP | disclosed |
| US-10266734-B2 | Curable composition, cured product, method for using curable composition, and optical device | LINTEC CORPORATION (JP) | 2019-04-23 | — | — | US | disclosed |
| EP-3187547-B1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2018-12-05 | — | — | EP | disclosed |
| CN-108383874-A | The method for being used to prepare acylphosphanes | 瑞士联邦苏黎世技术大学 | 2018-08-10 | — | — | CN | disclosed |
| CN-104703995-B | Process for preparing acylphosphanes | 瑞士联邦苏黎世技术大学 | 2018-04-20 | — | — | CN | disclosed |
| US-9783715-B2 | Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body | LINTEC CORPORATION (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170275513-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2017-09-28 | — | — | US | disclosed |
| CN-107001862-A | Slurry polymerisation compositions and by its obtained adhesive | 3M创新有限公司 | 2017-08-01 | — | — | CN | disclosed |
| US-8703880-B2 | Curable composition, cured product, and method for using of curable composition | LINTEC CORPORATION (JP) | 2014-04-22 | — | — | US | disclosed |
| US-8507044-B2 | Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device | LINTEC CORPORATION (JP) | 2013-08-13 | — | — | US | disclosed |
| US-8481669-B2 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2013-07-09 | — | — | US | disclosed |
| US-20130035455-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2013-02-07 | — | — | US | disclosed |
| US-8357261-B2 | Adhesive mainly composed of polyorganosiloxane compound | LINTEC CORPORATION (JP) | 2013-01-22 | — | — | US | disclosed |
| EP-2546306-A1 | CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC Corporation (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20090005530-A1 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-5679821-A | Process for preparing organosilicon compound | TOAGOSEI CO., LTD. (JP) | 1997-10-21 | — | — | US | disclosed |