SCHEMBL12274397

SCHEMBL12274397

CC(=O)Oc1ccc(S(C)(C)OS(=O)(=O)C(F)(F)F)cc1

nearest known ligand 0.56

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.56
POLB P06746 2/20 0.56
PKM P14618 1/20 0.56
PTGS2 P35354 4/20 0.45
LMNA P02545 3/20 0.43
ALDH1A1 P00352 2/20 0.43
ELANE P08246 2/20 0.42
HSD17B10 Q99714 1/20 0.41
HSP90AA1 P07900 1/20 0.41
GAA P10253 1/20 0.41
KDM4E B2RXH2 2/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
TTR P02766 1/20 0.40
TP53 P04637 1/20 0.40
CYP3A4 P08684 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
TDP1 Q9NUW8 1/20 0.39
CXCR2 P25025 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12273951 0.85 MMP2 (0.43) MAPTPOLBPKMELANEMEN1
SCHEMBL14674148 0.82 MAPT (0.53) MAPTPOLBPKMPTGS2LMNA
SCHEMBL3421884 0.82 MAPT (0.53) MAPTPOLBPKMPTGS2LMNA
SCHEMBL5857846 0.81 PKM (0.50) PKMPTGS2LMNAALDH1A1GAA
SCHEMBL6679775 0.80 MAPT (0.56) MAPTPOLBPKMPTGS2LMNA
SCHEMBL1886221 0.79 MAPT (0.65) MAPTPOLBPKMPTGS2LMNA
SCHEMBL562051 0.77 GAA (0.43) PTGS2ALDH1A1GAAMEN1KMT2A
SCHEMBL5857331 0.77 CA12 (0.51) MAPTPKMLMNAALDH1A1GAA
SCHEMBL36458 0.77 HTR6 (0.39) POLBLMNAALDH1A1HSD17B10MEN1
SCHEMBL751233 0.76 LMNA (0.61) MAPTPOLBPKMPTGS2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12434998-B2 Resin-coated ultra-thin glass TORAY INDUSTRIES, INC. (JP) 2025-10-07 US disclosed
US-20240199854-A1 COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM FUJIFLIM CORPORATION (JP) 2024-06-20 US disclosed
WO-2024057999-A1 COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2024-03-21 WO disclosed
US-20230365458-A1 RESIN-COATED ULTRA-THIN GLASS TORAY INDUSTRIES, INC. (JP) 2023-11-16 US disclosed
WO-2023210418-A1 THERMOSETTING COMPOSITION, CURED PRODUCT, AND OPTICAL MEMBER 富士フイルム株式会社 2023-11-02 WO disclosed
WO-2023032746-A1 COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2023-03-09 WO disclosed
WO-2022163191-A1 RESIN-COATED ULTRA-THIN GLASS 東レ株式会社 2022-08-04 WO disclosed
CN-107077070-B Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device 东丽株式会社 2020-06-16 CN disclosed
EP-3203320-B9 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2020-05-06 EP disclosed
EP-3203320-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2019-10-23 EP disclosed
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
EP-2799928-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT TORAY INDUSTRIES (JP) 2019-05-22 EP disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
EP-3203320-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Toray Industries, Inc. (JP) 2017-08-09 EP disclosed
US-9704724-B2 Photosensitive resin composition and method for producing semiconductor device TORAY INDUSTRIES, INC. (JP) 2017-07-11 US disclosed
EP-2799928-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT Toray Industries, Inc. (JP) 2014-11-05 EP disclosed
US-20140242787-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2014-08-28 US disclosed
US-20120237873-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM TORAY INDUSTRIES INC. (JP) 2012-09-20 US disclosed