Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SHBG | P04278 | 1/20 | 0.37 |
| ▸ | AKR1C2 | P52895 | 1/20 | 0.36 |
| ▸ | AKR1C1 | Q04828 | 1/20 | 0.36 |
| ▸ | PDE4A | P27815 | 1/20 | 0.35 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.35 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.35 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.35 |
| ▸ | EGFR | P00533 | 2/20 | 0.35 |
| ▸ | CDK4 | P11802 | 2/20 | 0.35 |
| ▸ | CCND1 | P24385 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.34 |
| ▸ | CASP6 | P55212 | 1/20 | 0.34 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.32 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.32 |
| ▸ | ADRB2 | P07550 | 2/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.32 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19965527 | 0.86 | SHBG (0.36) | SHBGHIF1ASMN1; SMN2 | |
| SCHEMBL4455166 | 0.79 | GABRA1 (0.45) | SHBGKDM4ECASP6GABRA1GABRB2 | |
| SCHEMBL3081907 | 0.78 | KDM4E (0.41) | SHBGKDM4ECASP6GABRA1GABRB2 | |
| SCHEMBL27536560 | 0.75 | SHBG (0.39) | SHBGKDM4ECASP6GABRA1GABRB2 | |
| SCHEMBL16865574 | 0.75 | SHBG (0.39) | SHBGKDM4ECASP6GABRA1GABRB2 | |
| SCHEMBL10130846 | 0.74 | PDE4A (0.43) | PDE4APDE4BPDE4CPDE4DKDM4E | |
| SCHEMBL4459305 | 0.73 | ALDH1A1 (0.43) | SHBGKDM4ECASP6GABRA1GABRB2 | |
| SCHEMBL27049060 | 0.73 | HSD17B10 (0.44) | SHBGKDM4ECASP6ADRB2CYP1A2 | |
| SCHEMBL14028988 | 0.72 | ADRB2 (0.39) | SHBGKDM4ECASP6ADRB2CYP1A2 | |
| SCHEMBL22991586 | 0.72 | TTR (0.44) | AKR1C2AKR1C1EGFRCDK4CCND1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180074403-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2018-03-15 | — | — | US | disclosed |
| EP-2133743-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2018-01-24 | — | — | EP | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-8871422-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2014-10-28 | — | — | US | disclosed |
| US-8871422-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2014-10-28 | — | — | US | disclosed |
| US-8758977-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-06-24 | — | — | US | disclosed |
| US-8758977-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-06-24 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| US-8298747-B2 | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20110171436-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-07-14 | — | — | US | disclosed |
| US-20110171436-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-07-14 | — | — | US | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100092879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| US-20100092879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| EP-2133743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2009-12-16 | — | — | EP | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |