SCHEMBL1246296

SCHEMBL1246296

O=[N+]([O-])c1ccccc1Cc1ccccc1O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPA5 P11021 1/20 0.59
ALDH1A1 P00352 4/20 0.56
TSHR P16473 1/20 0.56
GPR35 Q9HC97 2/20 0.52
SNCA P37840 1/20 0.52
HPGD P15428 1/20 0.51
AR P10275 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.46
CTSB P07858 1/20 0.46
NPC1 O15118 2/20 0.44
RAB9A P51151 2/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
CYP3A4 P08684 1/20 0.44
CYP2D6 P10635 1/20 0.44
CYP2C19 P33261 1/20 0.44
KEAP1 Q14145 1/20 0.44
KCNMA1 Q12791 1/20 0.44
HTT P42858 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL301933 0.88 ALDH1A1 (0.69) ALDH1A1TSHRGPR35HPGDAR
SCHEMBL20817208 0.88 GPR35 (0.53) HSPA5ALDH1A1TSHRGPR35SNCA
SCHEMBL28181536 0.87 ALDH1A1 (0.58) HSPA5ALDH1A1TSHRGPR35HPGD
Ammonia Solution, Strong SCHEMBL10338964 0.86 ALDH1A1 (0.67) ALDH1A1TSHRGPR35HPGDAR
SCHEMBL20817180 0.86 ALDH1A1 (0.53) ALDH1A1TSHRGPR35SNCAHPGD
SCHEMBL27279753 0.81 ALDH1A1 (0.52) HSPA5ALDH1A1TSHRGPR35SNCA
SCHEMBL4993310 0.80 SNCA (0.47) HSPA5ALDH1A1TSHRGPR35SNCA
SCHEMBL8141750 0.80 CASP6 (0.50) ALDH1A1TSHRGPR35SNCAHPGD
SCHEMBL1246299 0.79 KEAP1 (0.55) ALDH1A1TSHRGPR35SNCAHPGD
SCHEMBL4692660 0.78 ALDH1A1 (0.56) ALDH1A1TSHRHPGDARL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 US disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-109153841-B Resin composition 东丽株式会社 2021-12-31 CN disclosed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN disclosed
CN-107850844-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-09-07 CN disclosed
US-10990008-B2 Resin composition TORAY INDUSTRIES, INC. (JP) 2021-04-27 US disclosed
US-20200409263-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-31 US disclosed
US-10831101-B2 Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-11-10 US disclosed
EP-2824695-B1 PATTERN FORMING METHOD FUJIFILM CORP (JP) 2019-09-11 EP disclosed
US-20050266352-A1 Forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide is generated in a pattern shape; imparting electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape FUJI PHOTO FILM CO., LTD. 2005-12-01 US disclosed
US-20050214693-A1 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material FUJI PHOTO FILM CO., LTD. 2005-09-29 US disclosed
EP-1580595-A2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material FUJI PHOTO FILM CO., LTD. (JP) 2005-09-28 EP disclosed
WO-2005053368-A1 METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME FUJI PHOTO FILM CO., LTD. (JP) 2005-06-09 WO disclosed
US-20050064108-A1 Method of forming metal fine particle pattern and method of forming electroconductive pattern FUJI PHOTO FILM CO., LTD. 2005-03-24 US disclosed
EP-1508453-A2 Method of forming metal fine particle pattern and method of forming electroconductive pattern Fuji Photo Film Co., Ltd. (JP) 2005-02-23 EP disclosed
EP-1475230-A2 Image forming methods, pattern forming methods, pattern forming material and planographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2004-11-10 EP disclosed
US-20040209203-A1 Pattern forming method, image forming method, fine particle adsorption pattern forming method, conductive pattern forming method, pattern forming material and planographic printing plate FUJI PHOTO FILM CO., LTD. 2004-10-21 US disclosed
US-20040067434-A1 First forming a polymerization initiating layer, which is immobilized on a PET support by a crosslinking reaction, then bonding an acrylate monomer by irradiating; making a printing plate with pattern, photolithography FUJI PHOTO FILM CO., LTD. 2004-04-08 US disclosed
EP-1400544-A1 A method of graft polymerization and variety of materials utilizing the same as well as producing method thereof FUJI PHOTO FILM CO., LTD. (JP) 2004-03-24 EP disclosed