SCHEMBL125897

SCHEMBL125897

NCC[Si](O[Si](CCN)(c1ccccc1)c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HRH1 P35367 3/20 0.38
TAAR1 Q96RJ0 3/20 0.37
HTR2A P28223 4/20 0.36
LOXL2 Q9Y4K0 2/20 0.36
CYP2A6 P11509 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
KDM4E B2RXH2 2/20 0.33
MEN1 O00255 1/20 0.33
TRPM2 O94759 1/20 0.33
ALDH1A1 P00352 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
THRB P10828 1/20 0.33
HPGD P15428 1/20 0.33
ALOX15 P16050 1/20 0.33
TSHR P16473 1/20 0.33
ALOX12 P18054 1/20 0.33
MAPK1 P28482 1/20 0.33
KMT2A Q03164 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL126332 0.87 HTR2A (0.42) HRH1TAAR1HTR2ALOXL2CYP2A6
SCHEMBL12341669 0.81 TAAR1 (0.39) HRH1TAAR1HTR2ALOXL2CYP2A6
SCHEMBL15283418 0.80
SCHEMBL11732436 0.77 IDO1 (0.33)
SCHEMBL28542302 0.77 TAAR1 (0.31) TAAR1
SCHEMBL127764 0.77 HRH1 (0.37) HRH1TAAR1HTR2AKIF11MAOA
SCHEMBL5475785 0.75 MAOA (0.37) HRH1HTR2AKIF11MAOA
SCHEMBL13829447 0.75 HRH1 (0.36) HRH1HTR2AKIF11MAOA
SCHEMBL3418590 0.75 HRH1 (0.36) HRH1TAAR1HTR2AKIF11MAOA
SCHEMBL10889694 0.74 ALDH1A1 (0.34) ALDH1A1HPGDTSHRTDP1LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2949719-B1 ADHESIVE COMPOSITION TORAY INDUSTRIES (JP) 2022-11-09 EP claimed
US-20240381529-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG RESONAC CORPORATION (JP) 2024-11-14 US disclosed
US-20230331946-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2023-10-19 US disclosed
WO-2023042305-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG 株式会社レゾナック 2023-03-23 WO disclosed
EP-2949719-B1 ADHESIVE COMPOSITION TORAY INDUSTRIES (JP) 2022-11-09 EP disclosed
US-20220289976-A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE TORAY INDUSTRIES, INC. (JP) 2022-09-15 US disclosed
WO-2022059716-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE 昭和電工マテリアルズ株式会社 2022-03-24 WO disclosed
WO-2022059167-A1 METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES 昭和電工マテリアルズ株式会社 2022-03-24 WO disclosed
US-20220019146-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-01-20 US disclosed
US-20210405529-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-12-30 US disclosed
US-20070169886-A1 Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device TORAY INDUSTRIES, INC. (JP) 2007-07-26 US disclosed
EP-1788380-A1 METHOD OF ESTIMATING DISSOLUTION RATE OF POLYIMIDE, PROCESS FOR PRODUCING POLYIMIDE AND POLYIMIDE OBTAINED USING THE METHODS HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-05-23 EP disclosed
US-20070098995-A1 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device HITACHI CHEMICAL CO., LTD. (JP) 2007-05-03 US disclosed
EP-1739114-A1 POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2007-01-03 EP disclosed
EP-1721740-A1 HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2006-11-15 EP disclosed
EP-0510638-B1 Silicon-modified polyimide film and process for producing same CHISSO CORP (JP) 1995-10-11 EP disclosed
US-5300364-A Metal-clad laminates and method for producing same CHISSO CORPORATION (JP) 1994-04-05 US disclosed
EP-0510638-A1 Silicon-modified polyimide film and process for producing same CHISSO CORPORATION (JP) 1992-10-28 EP disclosed
EP-0498898-A1 FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING CHISSO CORPORATION (JP) 1992-08-19 EP disclosed
EP-0496334-A1 A flexible base laminated with metal on both the surfaces and a process for producing same CHISSO CORPORATION (JP) 1992-07-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20220019146-A1 FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN LIPA, MLLT3, EPB41L2 HRH1 4239/4885TAAR1 2908/4885HTR2A 1078/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.