SCHEMBL1270185

SCHEMBL1270185

OCC(O)C(O)SSC(O)C(O)CO

nearest known ligand 0.53

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
TDP1 Q9NUW8 2/20 0.44
ALDH1A1 P00352 1/20 0.35
KDM4E B2RXH2 2/20 0.32
PDE4A P27815 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2050017 0.82
SCHEMBL3493347 0.80 LMNA (0.59) LMNAL3MBTL1TDP1ALDH1A1KDM4E
SCHEMBL75409 0.79 LMNA (0.47) LMNAL3MBTL1TDP1ALDH1A1KDM4E
SCHEMBL6310074 0.73
SCHEMBL15635306 0.73
SCHEMBL2050718 0.73
SCHEMBL8581852 0.73
E968 SCHEMBL121807 0.71
E968 SCHEMBL10427336 0.71
E968 SCHEMBL2723809 0.71 LMNA (0.67) LMNAL3MBTL1TDP1ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12588450-B2 Post-CMP cleaning liquid comprising a substituted benzene anticorrosive agent, chelant, and amine compound FUJIFILM CORPORATION (JP) 2026-03-24 US disclosed
US-20250377594-A1 RESIST COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-12-11 US disclosed
US-12480072-B2 Cleaning fluid and cleaning method FUJIFILM CORPORATION (JP) 2025-11-25 US disclosed
US-20250321482-A1 RESIST COMPOSITION, DRY FILM RESIST, METHOD FOR PRODUCING DRY FILM RESIST, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED OBJECT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-10-16 US disclosed
US-20250278022-A1 COMPOUND, POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-09-04 US disclosed
US-20250231484-A1 RESIST COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-07-17 US disclosed
US-12264275-B2 Treatment liquid FUJIFILM CORPORATION (JP) 2025-04-01 US disclosed
US-12247300-B2 Cleaning solution and cleaning method FUJIFILM CORPORATION (JP) 2025-03-11 US disclosed
US-20250019623-A1 CLEANING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE FUJIFILM CORPORATION (JP) 2025-01-16 US disclosed
US-20250019836-A1 TREATMENT LIQUID, TREATMENT METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2025-01-16 US disclosed
US-20070243494-A1 Photoresist stripping solution and a method of stripping photoresists using the same YOKOI SHIGERU 2007-10-18 US disclosed
EP-1818722-A1 CHEMICAL AMPLIFICATION PHOTORESIST COMPOSITION, PHOTORESIST LAYER LAMINATE, METHOD FOR PRODUCING PHOTORESIST COMPOSITION, METHOD FOR PRODUCING PHOTORESIST PATTERN AND METHOD FOR PRODUCING CONNECTING TERMINAL TOKYO OHKA KOGYO CO., LTD. (JP) 2007-08-15 EP disclosed
US-20070134185-A1 Use of dithiols in a hair-perming composition L'OREAL S.A. (FR) 2007-06-14 US disclosed
US-20070003859-A1 Photoresist stripping solution and a method of stripping photoresists using the same YOKOI SHIGERU 2007-01-04 US disclosed
EP-1680077-A2 USE OF DITHIOLS IN A HAIR-PERMING COMPOSITION L'OREAL (FR) 2006-07-19 EP disclosed
US-20060035176-A1 Photoresist stripping solution and a method of stripping photoresists using the same YOKOI SHIGERU 2006-02-16 US disclosed
US-20050002886-A1 Dithiols comprising at least one amide functional group and their use in transforming the shape of the hair L'OREAL S.A. (FR) 2005-01-06 US disclosed
WO-2004098488-A2 USE OF DITHIOLS IN A HAIR-PERMING COMPOSITION L'OREAL (FR) 2004-11-18 WO disclosed
EP-1475076-A1 Amidic dithiols and their use in changing the hair form L'OREAL (FR) 2004-11-10 EP disclosed
US-20030099908-A1 Photoresist stripping solution and a method of stripping photoresists using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2003-05-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070134185-A1 Use of dithiols in a hair-perming composition DSG1, DSC1, DUS2 LMNA 2739/4885L3MBTL1 3362/4885TDP1 1080/4885
US-20250278022-A1 COMPOUND, POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN ABCC1, SLC11A2, RER1 LMNA 2700/4885L3MBTL1 4362/4885TDP1 3763/4885
US-20050002886-A1 Dithiols comprising at least one amide functional group and their use in transforming the shape of the hair TST, KRT18, DLAT LMNA 4162/4885L3MBTL1 3494/4885TDP1 1486/4885
US-12588450-B2 Post-CMP cleaning liquid comprising a substituted benzene anticorrosive agent, chelant, and amine compound SSRP1, H1-5, AOC1 LMNA 1164/4885L3MBTL1 3972/4885TDP1 740/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.