Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 1/20 | 0.34 |
| ▸ | HRH1 | P35367 | 2/20 | 0.33 |
| ▸ | HTR2A | P28223 | 1/20 | 0.33 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.33 |
| ▸ | KIF11 | P52732 | 1/20 | 0.32 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.32 |
| ▸ | TLR8 | Q9NR97 | 2/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL127426 | 0.98 | MAOA (0.35) | MAOAHRH1HTR2ACHRM2KIF11 | |
| SCHEMBL9706777 | 0.91 | MAOA (0.31) | MAOAHRH1HTR2A | |
| SCHEMBL5475785 | 0.82 | MAOA (0.37) | MAOAHRH1HTR2AKIF11KCNH2 | |
| SCHEMBL24433793 | 0.80 | KIF11 (0.37) | MAOAHRH1HTR2AKIF11KCNH2 | |
| SCHEMBL126332 | 0.79 | HTR2A (0.42) | MAOAHRH1HTR2AKIF11KCNH2 | |
| SCHEMBL30690859 | 0.77 | CA4 (0.32) | — | |
| SCHEMBL30690854 | 0.77 | CA4 (0.32) | — | |
| SCHEMBL127764 | 0.77 | HRH1 (0.37) | MAOAHRH1HTR2AKIF11KCNH2 | |
| SCHEMBL13829447 | 0.76 | HRH1 (0.36) | MAOAHRH1HTR2AKIF11KCNH2 | |
| SCHEMBL3418590 | 0.76 | HRH1 (0.36) | MAOAHRH1HTR2AKIF11KCNH2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | claimed |
| US-20240381529-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | RESONAC CORPORATION (JP) | 2024-11-14 | — | — | US | disclosed |
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | disclosed |
| US-20220289976-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | TORAY INDUSTRIES, INC. (JP) | 2022-09-15 | — | — | US | disclosed |
| WO-2022059716-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059167-A1 | METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| US-20220019146-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-01-20 | — | — | US | disclosed |
| US-20210405529-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-30 | — | — | US | disclosed |
| EP-1918341-A1 | ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-05-07 | — | — | EP | disclosed |
| EP-1901123-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-03-19 | — | — | EP | disclosed |
| US-20070260035-A1 | Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device | TORAY INDUSTRIES, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| US-20070225438-A1 | Resin Paste for Die Bonding | HITACHI CHEMICAL CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| EP-1788380-A1 | METHOD OF ESTIMATING DISSOLUTION RATE OF POLYIMIDE, PROCESS FOR PRODUCING POLYIMIDE AND POLYIMIDE OBTAINED USING THE METHODS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20070098995-A1 | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| EP-1739114-A1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2007-01-03 | — | — | EP | disclosed |
| EP-0510638-B1 | Silicon-modified polyimide film and process for producing same | CHISSO CORP (JP) | 1995-10-11 | — | — | EP | disclosed |
| EP-0510638-A1 | Silicon-modified polyimide film and process for producing same | CHISSO CORPORATION (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0496334-A1 | A flexible base laminated with metal on both the surfaces and a process for producing same | CHISSO CORPORATION (JP) | 1992-07-29 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20220019146-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | LIPA, MLLT3, EPB41L2 | MAOA 1238/4885HRH1 4239/4885HTR2A 1078/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.