Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 2/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 3/20 | 0.37 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | MCOLN3 | Q8TDD5 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | RAB9A | P51151 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10912372 | 0.71 | ALDH1A1 (0.48) | GAAMAPTNPSR1ALDH1A1KMT2A | |
| SCHEMBL11531317 | 0.71 | ALDH1A1 (0.61) | GAAKDM4EALDH1A1KMT2ACYP3A4 | |
| SCHEMBL8392984 | 0.70 | FAAH (0.50) | MAPTALDH1A1KMT2ACYP3A4RAB9A | |
| SCHEMBL2606475 | 0.69 | ALOX5 (0.37) | GAAHTTMAPTNPSR1KDM4E | |
| SCHEMBL6368535 | 0.69 | MAPT (0.50) | GAAMAPTNPSR1KDM4EMCOLN3 | |
| SCHEMBL11528735 | 0.68 | CYP1A2 (0.51) | GAAKDM4EALDH1A1KMT2ACYP3A4 | |
| SCHEMBL28136187 | 0.66 | LMNA (0.37) | HTTMAPTNPSR1KDM4EMCOLN3 | |
| SCHEMBL5530251 | 0.65 | HPGD (0.55) | GAAMAPTALDH1A1KMT2A | |
| SCHEMBL21437424 | 0.65 | MAPT (0.35) | MAPTNPSR1KDM4EMCOLN3ALDH1A1 | |
| SCHEMBL11529832 | 0.63 | ALDH1A1 (0.50) | GAAKDM4EALDH1A1KMT2ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115244470-A | Removing liquid, kit and semiconductor device | 富士胶片株式会社 | 2022-10-25 | — | — | CN | disclosed |
| WO-2022050313-A1 | METHOD FOR MANUFACTURING ORGANIC LAYER PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| CN-113574455-A | Laminate, composition, and laminate-forming kit | 富士胶片株式会社 | 2021-10-29 | — | — | CN | disclosed |
| WO-2020196362-A1 | MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY | 富士フイルム株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020195995-A1 | MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY | 富士フイルム株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2019163859-A1 | PHOTOSENSITIVE LAYER, LAMINATE, PHOTOSENSITIVE RESIN COMPOSITION, KIT, AND PRODUCTION METHOD FOR PHOTOSENSITIVE RESIN COMPOSITION | 富士フイルム株式会社 | 2019-08-29 | — | — | WO | disclosed |
| WO-2019163951-A1 | PHOTOSENSITIVE LAYER, LAMINATE, PHOTOSENSITIVE RESIN COMPOSITION, AND KIT | 富士フイルム株式会社 | 2019-08-29 | — | — | WO | disclosed |
| EP-1267210-B1 | Positive resist composition | FUJIFILM CORP (JP) | 2018-02-21 | — | — | EP | disclosed |
| EP-2447773-B1 | Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure | FUJIFILM CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| EP-1903080-B1 | Ink composition, inkjet recording method, and printed material | FUJIFILM CORP (JP) | 2012-10-31 | — | — | EP | disclosed |
| US-20030059715-A1 | Positive resist composition | FUJI PHOTO FILM CO., LTD. | 2003-03-27 | — | — | US | disclosed |
| US-20030044715-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. | 2003-03-06 | — | — | US | disclosed |
| US-20030031950-A1 | A compound capable of generating an acid upon irradiation; a resin capable of decomposing by the action of an acid to increase the solubility; and a specified dissolution-inhibiting compound. | FUJI PHOTO FILM CO., LTD | 2003-02-13 | — | — | US | disclosed |
| US-6506535-B1 | A positive working photoresist composition for use in the production of semiconductor integrated circuit devices, mask for the production of integrated circuits, printed wiring boards, liquid crystal panels | FUJI PHOTO FILM CO., LTD. (JP) | 2003-01-14 | — | — | US | disclosed |
| US-20030008241-A1 | Positive-working resist composition | FUJI PHOTO FILM CO., LTD. | 2003-01-09 | — | — | US | disclosed |
| EP-1267210-A2 | Positive resist composition | FUJI PHOTO FILM CO., LTD. (JP) | 2002-12-18 | — | — | EP | disclosed |
| US-6479211-B1 | FOR FAR ULTRAVIOLET EXPOSURE, WHICH CAN FORM A HIGHLY PRECISE PATTERN USING LIGHT IN THE FAR ULTRAVIOLET REGION INCLUDING AN EXCIMER LASER RAY, PARTICULARLY, IN THE REGION OF 250 NM OR LESS | FUJI PHOTO FILM CO., LTD. (JP) | 2002-11-12 | — | — | US | disclosed |
| US-20020064727-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. | 2002-05-30 | — | — | US | disclosed |
| US-20020048720-A1 | Positive photoresist composition | FUJIFILM CORPORATION (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20020009666-A1 | Positive photoresist composition | FUJIFILM CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |