SCHEMBL1334154

SCHEMBL1334154

C=CCc1c(N)ccc(-c2ccc(N)cc2)c1CC=C

nearest known ligand 0.41

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
IMPDH2 P12268 1/20 0.41
ALDH1A1 P00352 3/20 0.36
CYP3A4 P08684 2/20 0.36
TDP1 Q9NUW8 2/20 0.36
TP53 P04637 1/20 0.36
MAPT P10636 2/20 0.32
HPGD P15428 2/20 0.32
GAA P10253 1/20 0.32
KDM4E B2RXH2 1/20 0.32
RAB9A P51151 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
GABRA1 P14867 2/20 0.32
GABRB2 P47870 2/20 0.32
TAAR1 Q96RJ0 1/20 0.31
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5333323 0.84 IMPDH2 (0.49) IMPDH2ALDH1A1CYP3A4TP53MAPT
Hydrochloric Acid SCHEMBL10885430 0.82 IMPDH2 (0.47) IMPDH2ALDH1A1MAPTHPGDGAA
SCHEMBL845635 0.82 IMPDH2 (0.53) IMPDH2ALDH1A1CYP3A4TP53MAPT
SCHEMBL15738942 0.79 ALDH1A1 (0.33) ALDH1A1CYP3A4TDP1TP53
SCHEMBL29900410 0.77 NCOA1 (0.44) ALDH1A1CYP3A4TDP1MAPTHPGD
SCHEMBL5333330 0.77
Hydrochloric Acid SCHEMBL10885447 0.76
SCHEMBL8675962 0.76 GABRA1 (0.44) ALDH1A1CYP3A4TDP1TP53MAPT
SCHEMBL5346830 0.74 CYP19A1 (0.46) ALDH1A1CYP3A4TDP1KDM4ETAAR1
SCHEMBL11129444 0.73 TDP1 (0.39) ALDH1A1CYP3A4TDP1TP53MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105367794-A Soluble thermoplastic polyimide composition and laminate made therefrom TAIFLEX SCIENT CO LTD 2016-03-02 CN claimed
WO-2023195206-A1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE JFEケミカル株式会社 2023-10-12 WO disclosed
CN-107531999-B Thermally conductive silicone grease composition 信越化学工业株式会社 2020-10-27 CN disclosed
US-10585079-B2 Chlorine-concentration-measuring composition KURITA WATER INDUSTRIES LTD. (JP) 2020-03-10 US disclosed
US-9793483-B2 Hexafluoroisopropanol group-containing diamine, polyimide and polyamide using same, cyclized product thereof, and method for producing same CENTRAL GLASS COMPANY, LIMITED (JP) 2017-10-17 US disclosed
US-20160377583-A1 CHLORINE-CONCENTRATION-MEASURING COMPOSITION KURITA WATER INDUSTRIES LTD. (JP) 2016-12-29 US disclosed
EP-2716351-B1 GAS SEPARATION MEMBRANE CENTRAL GLASS CO LTD (JP) 2016-06-29 EP disclosed
CN-105367794-A Soluble thermoplastic polyimide composition and laminate made therefrom TAIFLEX SCIENT CO LTD 2016-03-02 CN disclosed
US-9061253-B2 Gas separation membrane CENTRAL GLASS COMPANY, LIMITED (JP) 2015-06-23 US disclosed
US-9056285-B2 Gas separation membrane CENTRAL GLASS COMPANY, LIMITED (JP) 2015-06-16 US disclosed
US-6949619-B2 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-09-27 US disclosed
US-6808819-B2 POLYIMIDE RESIN, EPOXY RESIN-CURING CATALYST, AND AN EPOXY RESIN SHIN ETSU CHEMICAL CO., LTD. (JP) 2004-10-26 US disclosed
US-20040105990-A1 Wafer dicing/die bonding sheet SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-06-03 US disclosed
US-20040019174-A1 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-01-29 US disclosed
US-20030220455-A1 Comprises epoxy resins and polyimides; for printed circuits and semiconductor packages SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-11-27 US disclosed
US-20030158350-A1 Heat resistant resin composition and adhesive film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-08-21 US disclosed
EP-0659800-B1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition CENTRAL GLASS CO LTD (JP) 1999-06-23 EP disclosed
US-5840369-A SCREEN PRINTING POLYIMIDE PRECURSOR INK ON SUBSTRATE, REMOVING SOLVENT, THERMALLY CURING INK TO FORM POLYIMIDE RELIEF PATTERN FILM CENTRAL GLASS CO., LTD. (JP) 1998-11-24 US disclosed
US-5686525-A THIXOTROPIC SCREEN PRINTING INK COMPRISING A HEAT TREATED POLYAMIC ACID SOLUTION OBTAINED BY REACTION OF AROMATIC TETRACARBOXYLIC ACID, DIAMINE AND A MALEIMIDE; RELIEF IMAGES CENTRAL GLASS COMPANY, LTD. (JP) 1997-11-11 US disclosed
EP-0659800-A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition CENTRAL GLASS COMPANY, LIMITED (JP) 1995-06-28 EP disclosed