Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR2A | P28223 | 2/20 | 0.49 |
| ▸ | HTR2C | P28335 | 2/20 | 0.49 |
| ▸ | HTR2B | P41595 | 2/20 | 0.49 |
| ▸ | HRH3 | Q9Y5N1 | 2/20 | 0.49 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.47 |
| ▸ | IDO1 | P14902 | 2/20 | 0.44 |
| ▸ | PDPK1 | O15530 | 1/20 | 0.44 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.42 |
| ▸ | DRD1 | P21728 | 2/20 | 0.42 |
| ▸ | DRD5 | P21918 | 2/20 | 0.42 |
| ▸ | CYP11B2 | P19099 | 1/20 | 0.42 |
| ▸ | KDM1A | O60341 | 1/20 | 0.41 |
| ▸ | NPC1 | O15118 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28886942 | 0.82 | ADRA1A (0.43) | HTR2AADRA1AIDO1PDPK1SIGMAR1 | |
| SCHEMBL2984209 | 0.80 | IDO1 (0.48) | HTR2AADRA1AIDO1PDPK1SIGMAR1 | |
| SCHEMBL8735629 | 0.78 | ADRA1A (0.46) | ADRA1AIDO1PDPK1SIGMAR1CYP11B2 | |
| SCHEMBL1046129 | 0.78 | PDPK1 (0.40) | HTR2AHTR2CHTR2BHRH3ADRA1A | |
| SCHEMBL30480958 | 0.76 | NPC1 (0.43) | HTR2AHTR2CHTR2BHRH3DRD1 | |
| SCHEMBL5710152 | 0.76 | PIN1 (0.51) | ADRA1AIDO1PDPK1SIGMAR1DRD1 | |
| SCHEMBL8849605 | 0.76 | DDB1 (0.53) | HTR2AHTR2CHTR2BHRH3ADRA1A | |
| SCHEMBL78935 | 0.76 | IDO1 (0.44) | HTR2AADRA1AIDO1PDPK1SIGMAR1 | |
| SCHEMBL503849 | 0.75 | SIGMAR1 (0.62) | HTR2AHTR2CHTR2BHRH3ADRA1A | |
| SCHEMBL29390302 | 0.75 | SIGMAR1 (0.62) | HTR2AHTR2CHTR2BHRH3ADRA1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 134 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210009778-A1 | FLAME-RESISTANT FOAMED STYRENE-BASED RESIN COMPOSITION | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 2021-01-14 | — | — | US | claimed |
| EP-3670585-A1 | FLAME-RESISTANT FOAMED STYRENE-BASED RESIN COMPOSITION | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2020-06-24 | — | — | EP | claimed |
| CN-111032755-A | Flame-retardant expandable styrene resin composition | 第一工业制药株式会社 | 2020-04-17 | — | — | CN | claimed |
| EP-2426165-B1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN COMPOSITION | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 2016-06-29 | — | — | EP | claimed |
| US-9187607-B2 | Flame-retarded foamable styrene-based resin compositions | DAI-ICHI KOGYO SEIYAKU, CO., LTD. (JP) | 2015-11-17 | — | — | US | claimed |
| EP-2426152-B1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN PARTICLES AND METHOD FOR PRODUCING SAME | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 2014-06-04 | — | — | EP | claimed |
| CN-102356096-B | Flame-retardant expandable styrene resin particles and method for producing same | DAI ICHI KOGYO SEIYAKU CO LTD | 2014-05-21 | — | — | CN | claimed |
| CN-102356123-B | Flame-retardant expandable styrene resin composition | DAI ICHI KOGYO SEIYAKU CO LTD | 2013-03-27 | — | — | CN | claimed |
| EP-2426152-A1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN PARTICLES AND METHOD FOR PRODUCING SAME | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2012-03-07 | — | — | EP | claimed |
| EP-2426165-A1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN COMPOSITION | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2012-03-07 | — | — | EP | claimed |
| CN-102356123-A | Flame-retardant expandable styrene resin composition | DAI ICHI KOGYO SEIYAKU CO LTD | 2012-02-15 | — | — | CN | claimed |
| CN-102356096-A | Flame-retardant expandable styrene resin particles and method for producing same | DAI ICHI KOGYO SEIYAKU CO LTD | 2012-02-15 | — | — | CN | claimed |
| US-20110319507-A1 | FLAME-RETARDED FOAMABLE STYRENE-BASED RESIN BEADS AND PROCESS FOR PRODUCING THE SAME | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 2011-12-29 | — | — | US | claimed |
| US-11970612-B2 | Polyamide composition and molded product composed of said polyamide composition | KURARAY CO., LTD. (JP) | 2024-04-30 | — | — | US | disclosed |
| CN-115210340-B | Flame retardant composition for styrene resin foam, flame retardant styrene resin foam composition, and extrusion molded foam thereof | 第一工业制药株式会社 | 2024-04-05 | — | — | CN | disclosed |
| US-20240101807-A1 | FLAME RETARDANT COMPOSITION FOR FOAMED STYRENE RESIN, FLAME-RETARDANT FOAMED STYRENE-BASED RESIN COMPOSITION, AND EXTRUSION FOAM-MOLDED PRODUCT OF SAME | DKS CO. LTD. (JP) | 2024-03-28 | — | — | US | disclosed |
| CN-101802049-A | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2010-08-11 | — | — | CN | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |
| US-20060106122-A1 | Extruded polystyrene resin foam board and process for preparing the same | JSP CORPORATION (JP) | 2006-05-18 | — | — | US | disclosed |