SCHEMBL1371114

SCHEMBL1371114

C[Si](C)(Nc1ccccc1)O[Si](C)(C)Nc1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.43
TDP1 Q9NUW8 6/20 0.41
ALDH1A1 P00352 4/20 0.41
HSD17B10 Q99714 3/20 0.41
CTSD P07339 1/20 0.41
MEN1 O00255 4/20 0.41
MAPT P10636 4/20 0.41
KMT2A Q03164 4/20 0.41
KDM4E B2RXH2 2/20 0.41
ALPG P10696 1/20 0.41
RAB9A P51151 1/20 0.41
AR P10275 1/20 0.40
PTGS2 P35354 2/20 0.39
MAPK1 P28482 2/20 0.39
L3MBTL1 Q9Y468 2/20 0.39
ALOX15 P16050 1/20 0.39
ALOX12 P18054 1/20 0.39
PTGS1 P23219 1/20 0.39
SLC6A2 P23975 1/20 0.39
HTR2B P41595 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27980315 0.90 TSHR (0.40) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL15950287 0.78 TSHR (0.39) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL9181403 0.78 TSHR (0.48) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL49520 0.78 TSHR (0.48) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL717181 0.78 TSHR (0.48) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL980166 0.75 TSHR (0.40) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL6910659 0.74 TSHR (0.43) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL7691374 0.74 ALDH1A1 (0.53) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL11852672 0.72 TSHR (0.42) TSHRTDP1ALDH1A1HSD17B10CTSD
SCHEMBL2200402 0.72 TSHR (0.42) TSHRTDP1ALDH1A1HSD17B10CTSD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024150723-A1 METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION 東レ株式会社 2024-07-18 WO disclosed
WO-2024150722-A1 LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT 東レ株式会社 2024-07-18 WO disclosed
WO-2024057730-A1 ORGANIC EL DISPLAY DEVICE 東レ株式会社 2024-03-21 WO disclosed
US-20240052103-A1 POLYMER AND TRIAZINE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-15 US disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
WO-2023233895-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023233896-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023176172-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-09-21 WO disclosed
EP-3284771-B1 HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT TORAY INDUSTRIES (JP) 2023-08-30 EP disclosed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
EP-1909142-B1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER TORAY INDUSTRIES (JP) 2015-06-24 EP disclosed
US-20150125680-A1 SUBSTRATE AND TOUCH PANEL MEMBER USING SAME TORAY INDUSTRIES, INC. (JP) 2015-05-07 US disclosed
EP-2853386-A1 SUBSTRATE AND TOUCH PANEL MEMBER USING SAME Toray Industries, Inc. (JP) 2015-04-01 EP disclosed
US-8895676-B2 Resin composition and display device using the same TORAY INDUSTRIES, INC. (JP) 2014-11-25 US disclosed
US-20140191222-A1 RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2014-07-10 US disclosed
US-8709552-B2 Resin composition and display device using the same TORAY INDUSTRIES, INC. (JP) 2014-04-29 US disclosed
US-20110284855-A1 RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2011-11-24 US disclosed
US-7977028-B2 Photosensitive resin composition and adhesion promoter TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER TORAY INDUSTRIES, INC. (JP) 2009-05-14 US disclosed
EP-1909142-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER TORAY INDUSTRIES, INC. (JP) 2008-04-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER PCNA, TERB1, SMC2 TSHR 4306/4885TDP1 652/4885ALDH1A1 1144/4885
US-20240052103-A1 POLYMER AND TRIAZINE COMPOUND TERT, TERB1, MCM5 TSHR 1593/4885TDP1 2325/4885ALDH1A1 1603/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.