SCHEMBL13840729

SCHEMBL13840729

Cc1cc(CN2C(=O)c3ccccc3C2=O)c(O)c(-n2n3c4ccccc4n23)c1

nearest known ligand 0.42

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ MEN1 O00255 5/20 0.42
▸ KMT2A Q03164 5/20 0.42
▸ RXFP1 Q9HBX9 2/20 0.42
▸ ALOX15 P16050 3/20 0.40
▸ HSD17B10 Q99714 2/20 0.40
▸ ALDH1A1 P00352 1/20 0.40
▸ GAA P10253 1/20 0.40
▸ HTT P42858 1/20 0.40
▸ RPS6KA2 Q15349 1/20 0.40
▸ MAPT P10636 2/20 0.39
▸ TGM2 P21980 1/20 0.39
▸ RECQL P46063 1/20 0.39
▸ HPGD P15428 2/20 0.39
▸ PABPC1 P11940 1/20 0.39
▸ MAPK1 P28482 1/20 0.39
▸ LMNA P02545 1/20 0.37
▸ TSHR P16473 1/20 0.37
▸ POLB P06746 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2612594 0.85 KDM4E (0.39) MEN1KMT2ARXFP1HSD17B10ALDH1A1
SCHEMBL14607286 0.83 GABRA1 (0.37) MEN1KMT2AHSD17B10ALDH1A1GAA
SCHEMBL29388780 0.80 NPC1 (0.53) MEN1KMT2ARXFP1ALOX15HSD17B10
SCHEMBL30772443 0.80 NPC1 (0.53) MEN1KMT2ARXFP1ALOX15HSD17B10
SCHEMBL674407 0.80 NPC1 (0.53) MEN1KMT2ARXFP1ALOX15HSD17B10
SCHEMBL13927493 0.79 AMY1A (0.46) HSD17B10GAAHPGDLMNAPOLB
SCHEMBL13840732 0.74 BCL2 (0.46) —
SCHEMBL13683238 0.73 ALDH1A1 (0.39) ALDH1A1HTTMAPTHPGDLMNA
SCHEMBL426807 0.72 NPC1 (0.52) MEN1KMT2ARXFP1ALDH1A1MAPT
SCHEMBL30061256 0.72 NPC1 (0.52) MEN1KMT2ARXFP1ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7534539-B2 Electrophotographic photoreceptor and image forming apparatus having the same SHARP KABUSHIKI KAISHA (JP) 2009-05-19 — — US disclosed
US-20090050268-A1 Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material MORITA MITSUNOBU 2009-02-26 — — US disclosed
US-7452595-B2 Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2008-11-18 — — US disclosed
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