SCHEMBL1552332

SCHEMBL1552332

Cc1ccc(O)c(-c2c(C)c(C)c(C)c(C)c2O)c1C

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 2/20 0.38
ATM Q13315 1/20 0.38
TDP2 O95551 1/20 0.35
NSD2 O96028 1/20 0.35
HSP90AA1 P07900 1/20 0.35
PAX8 Q06710 1/20 0.35
SENP1 Q9P0U3 1/20 0.35
MAOA P21397 4/20 0.33
MAOB P27338 3/20 0.33
TP53 P04637 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
ELANE P08246 1/20 0.33
CTSG P08311 1/20 0.33
ALDH1A1 P00352 2/20 0.32
KMT2A Q03164 2/20 0.31
TXNRD1 Q16881 2/20 0.31
KDM4E B2RXH2 1/20 0.31
MEN1 O00255 1/20 0.31
NPC1 O15118 1/20 0.31
USP2 O75604 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10757570 0.87 TRPA1 (0.38) TRPA1ATMTDP2NSD2HSP90AA1
SCHEMBL6227967 0.86 TRPA1 (0.48) TRPA1ATMTDP2NSD2HSP90AA1
SCHEMBL14916565 0.84 ELANE (0.44) TRPA1ATMTDP2NSD2HSP90AA1
SCHEMBL992964 0.75 SENP1 (0.39) SENP1
SCHEMBL10363177 0.74 ALDH1A1 (0.34) NSD2SENP1TP53ALDH1A1KDM4E
SCHEMBL1557463 0.74 CYP2C9 (0.43) TRPA1ATMTP53TDP1ALDH1A1
SCHEMBL4453425 0.72 SYNJ2 (0.32) SENP1KMT2AMEN1POLBRECQL
SCHEMBL982859 0.71 TRPA1 (0.44) TRPA1ATMHSP90AA1MAOAMAOB
SCHEMBL68586 0.71 TRPA1 (0.48) TRPA1ATMTP53TDP1ALDH1A1
SCHEMBL30925076 0.71 TRPA1 (0.48) TRPA1ATMTP53TDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025058023-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2025-03-20 WO disclosed
WO-2025058024-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATED SHEET, COMPOSITE RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2025-03-20 WO disclosed
WO-2025058025-A1 RESIN COMPOSITION, CURED ARTICLE, PREPREG, METAL-FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2025-03-20 WO disclosed
WO-2025058027-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2025-03-20 WO disclosed
WO-2025058028-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2025-03-20 WO disclosed
WO-2025058026-A1 RESIN COMPOSITION, CURED ARTICLE, PREPREG, METAL-FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2025-03-20 WO disclosed
EP-3931238-A1 CROSS-LINKABLE NETWORK FROM FUNCTIONALIZED POLYETHERIMIDE AND THERMOSET POLYMER RESULTING THEREFROM SHPP Global Technologies B.V. (NL) 2022-01-05 EP disclosed
CN-110869454-A Solid homogeneous amorphous high-heat epoxy resin blend, product and application thereof 沙特基础工业全球技术有限公司 2020-03-06 CN disclosed
CN-107663374-B Resin composition, semi-cured sheet and laminate 台燿科技股份有限公司 2020-02-11 CN disclosed
US-9062145-B2 Curable resin composition, curable film and their cured products MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-06-23 US disclosed
WO-2003045883-A1 PROCESS FOR PREPARING 3,3',5,5',6,6'-HEXAALKYL-2,2'-BIPHENOLS, 3,3',4,4',5,5'-HEXAALKYL-2,2'-BIPHENOLS AND 3,3',4,4',5,5',6,6'-OCTAALKYL-2,2'-BIPHENOLS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2003-06-05 WO disclosed
US-6025503-A REACTING OPTICALLY ACTIVE(OR RACEMIC) TITANIUM ALKOXIDE COMPLEXES WITH CHIRAL ACTIVATORS(ESPECIALLY DIOLS) YIELDS NEW TITANIUM COMPLEXES WHICH ARE ENANTIO-SELECTIVE IN C-C BOND FORMING REACTIONS TAKASAGO INTERNATIONAL CORPORATION (JP) 2000-02-15 US disclosed
EP-0475272-B1 Process for the preparation of 2,3,5-trimethyl-p-benzoquinone BASF AG (DE) 1995-01-11 EP disclosed
US-5104996-A Catalytic oxidation of 2,3,6-trimethylphenol EISAI CO., LTD. (JP) 1992-04-14 US disclosed
EP-0475272-A2 Process for the preparation of 2,3,5-trimethyl-p-benzoquinone BASF Aktiengesellschaft (DE) 1992-03-18 EP disclosed
EP-0294584-B1 PROCESS FOR PREPARING 2,3,5-TRIMETHYLBENZOQUINONE Eisai Co., Ltd. (JP) 1992-01-15 EP disclosed
US-4828762-A 2,3,6-TRIMETHYLPHENOL, OXYGEN, ALKALI METAL OR AMMONIUM COPPER HALIDE COMPLEX CATALYST MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1989-05-09 US disclosed
EP-0167153-B1 PROCESS FOR THE PREPARATION OF 2,3,5-TRIMETHYLBENZOQUINONE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1989-02-22 EP disclosed
EP-0294584-A1 Process for preparing 2,3,5-trimethylbenzoquinone Eisai Co., Ltd. (JP) 1988-12-14 EP disclosed
EP-0167153-A1 Process for the preparation of 2,3,5-trimethylbenzoquinone MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1986-01-08 EP disclosed