SCHEMBL1607770

SCHEMBL1607770

O=C1CCC(=O)N1OS(=O)(=O)c1ccc(Cl)cc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARL Q9H300 2/20 0.68
ALDH1A1 P00352 4/20 0.55
HPGD P15428 3/20 0.55
KDM4E B2RXH2 2/20 0.55
MMP2 P08253 1/20 0.49
KMT2A Q03164 3/20 0.46
TDP1 Q9NUW8 1/20 0.44
VDR P11473 1/20 0.44
MEN1 O00255 1/20 0.44
CYP3A4 P08684 2/20 0.43
MAPK1 P28482 1/20 0.43
MAPT P10636 1/20 0.43
GAA P10253 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
CTSG P08311 1/20 0.41
CMA1 P23946 1/20 0.41
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA3 P07451 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12339094 0.90 PARL (0.81) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL452440 0.83 PARL (0.70) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL5557804 0.82 ALDH1A1 (0.56) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL64214 0.81 PARL (0.68) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL8490590 0.81 PARL (0.68) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL64964 0.81 PARL (1.00) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL4831944 0.80 ALDH1A1 (0.54) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL4837175 0.80 ALDH1A1 (0.50) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL7973261 0.79 PARL (1.00) PARLALDH1A1HPGDKDM4EMMP2
SCHEMBL65074 0.79 GAA (0.66) PARLALDH1A1KDM4EMMP2VDR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6569596-B1 Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-05-27 US claimed
EP-2138897-B1 CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN FUJITSU LTD (JP) 2016-08-03 EP disclosed
US-8795951-B2 Material for forming resist sensitization film and production method of semiconductor device FUJITSU LIMITED (JP) 2014-08-05 US disclosed
US-8557144-B2 Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head FUJITSU LIMITED (JP) 2013-10-15 US disclosed
US-20110198730-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION 2011-08-18 US disclosed
US-20110101503-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION (JP) 2011-05-05 US disclosed
US-20110081615-A1 MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-04-07 US disclosed
US-7759045-B2 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-07-20 US disclosed
US-20100009296-A1 MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2138897-A1 MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD Fujitsu Limited (JP) 2009-12-30 EP disclosed
CN-101334588-A Chemically amplified positive resist composition SUMITOMO CHEMICAL CO (JP) 2008-12-31 CN disclosed
US-20080160449-A1 Photoresist polymer having nano-smoothness and etching resistance, and resist composition LION CORPORATION (JP) 2008-07-03 US disclosed
US-20070148585-A1 Hyperbranched polymer, production method therefor and resist composition containing hyperbranched polymer LION CORPORATION. 2007-06-28 US disclosed
EP-1698645-A1 HYPERBRANCHED POLYMER, PROCESS FOR PRODUCING THE SAME AND RESIST COMPOSITION CONTAINING THE HYPERBRANCHED POLYMER Lion Corporation (JP) 2006-09-06 EP disclosed
US-6893794-B2 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2005-05-17 US disclosed
US-20040018445-A1 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-01-29 US disclosed
US-6569596-B1 Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-05-27 US disclosed
US-6068962-A NOVOLAK RESIN AS AN ALKALI-SOLUBLE COMPONENT; QUINONEDIAZIDE; ACID GENERATOR; ANTHRACENE DERIVATIVE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-05-30 US disclosed
EP-0917000-A2 Positive resist composition and method for forming a resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-05-19 EP disclosed
EP-0831371-A2 Positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-03-25 EP disclosed