SCHEMBL5557804

SCHEMBL5557804

O=C1C2=C(CCCC2)C(=O)N1OS(=O)(=O)c1ccc(Cl)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.56
KDM4E B2RXH2 6/20 0.56
HPGD P15428 5/20 0.56
PARL Q9H300 2/20 0.46
KMT2A Q03164 5/20 0.45
VDR P11473 2/20 0.45
MEN1 O00255 2/20 0.45
MAPT P10636 4/20 0.45
F2 P00734 1/20 0.44
PTGS2 P35354 2/20 0.43
PTGS1 P23219 1/20 0.43
LMNA P02545 1/20 0.40
THRB P10828 1/20 0.40
HTT P42858 1/20 0.39
MMP2 P08253 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
CYP2C19 P33261 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5552236 0.84 VDR (0.65) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL5551764 0.82 GAA (0.51) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL1607770 0.82 PARL (0.68) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL5557802 0.79 ALDH1A1 (0.60) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL8778106 0.78 KDM4E (0.76) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL4831944 0.73 ALDH1A1 (0.54) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL4837175 0.73 ALDH1A1 (0.50) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL7572742 0.72 ALDH1A1 (1.00) ALDH1A1KDM4EHPGDKMT2AVDR
SCHEMBL12339094 0.72 PARL (0.81) ALDH1A1KDM4EHPGDPARLKMT2A
SCHEMBL3825331 0.71 KDM4E (0.58) ALDH1A1KDM4EHPGDKMT2AVDR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2013141376-A1 PROTECTANT, METHOD FOR PRODUCING COMPOUND PROTECTED BY PROTECTANT, RESIN PROTECTED BY PROTECTANT, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING RESIN PROTECTED BY PROTECTANT, PATTERN-FORMING MATERIAL, PHOTOSENSITIVE FILM, CURED RELIEF PATTERN, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 (JP) 2013-09-26 WO disclosed
WO-2013018524-A1 PHOTOSENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING RELIEF PATTERN, PHOTOSENSITIVE FILM, POLYIMIDE FILM, CURED RELIEF PATTERN AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 (JP) 2013-02-07 WO disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed