SCHEMBL1661824

SCHEMBL1661824

COC(=O)C(C)(C(C)=O)C(=O)OC

nearest known ligand 0.44

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
DGAT1 O75907 1/20 0.44
ALDH1A1 P00352 3/20 0.42
KCNN4 O15554 1/20 0.34
GAA P10253 2/20 0.33
MGAM O43451 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33
MAPT P10636 1/20 0.31
SRC P12931 1/20 0.31
KEAP1 Q14145 1/20 0.30
NFE2L2 Q16236 1/20 0.30
HCAR2 Q8TDS4 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9788248 0.79 DGAT1 (0.34) DGAT1ALDH1A1KCNN4GAAMGAM
SCHEMBL1022153 0.77 DGAT1 (0.56) DGAT1ALDH1A1KCNN4GAAMGAM
SCHEMBL2097450 0.77 DGAT1 (0.44) DGAT1ALDH1A1KCNN4MAPTSRC
SCHEMBL1527282 0.75
SCHEMBL18778754 0.74 DGAT1 (0.54) DGAT1ALDH1A1KCNN4GAAMGAM
SCHEMBL2552792 0.74 DGAT1 (0.42) DGAT1ALDH1A1KCNN4GAAMGAM
SCHEMBL17826670 0.74 DGAT1 (0.42) DGAT1ALDH1A1KCNN4GAAMGAM
SCHEMBL374099 0.73 LMNA (0.42) ALDH1A1GAATSHR
SCHEMBL18868424 0.73 ALDH1A1 (0.44) DGAT1ALDH1A1KCNN4GAAMGAM
SCHEMBL11422045 0.73 ALDH1A1 (0.44) DGAT1ALDH1A1KCNN4GAAMGAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115819354-B Synthesis method of alkyl substituted 6-alkyl-4-aminopyridazine or salt thereof 杭州澳赛诺生物科技有限公司 2024-11-01 CN disclosed
US-8084545-B2 Photo- and/or thermo-curable copolymer, curable resin compositions, and cured articles DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2011-12-27 US disclosed
US-20110112266-A1 CURABLE COPOLYMER AND CURABLE RESIN COMPOSITION DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2011-05-12 US disclosed
EP-2308905-A1 CURABLE COPOLYMER AND CURABLE RESIN COMPOSITION Daicel Chemical Industries, Ltd. (JP) 2011-04-13 EP disclosed
US-20100137515-A1 PHOTO- AND/OR THERMO-CURABLE COPOLYMER, CURABLE RESIN COMPOSITIONS, AND CURED ARTICLES DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-06-03 US disclosed
EP-2147937-A1 PHOTO- AND/OR THERMO-CURABLE COPOLYMER, CURABLE RESIN COMPOSITIONS, AND CURED ARTICLES Daicel Chemical Industries, Ltd. (JP) 2010-01-27 EP disclosed