Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.42 |
| ▸ | HPGD | P15428 | 4/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.42 |
| ▸ | USP2 | O75604 | 2/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.39 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | CA12 | O43570 | 1/20 | 0.37 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | CA4 | P22748 | 1/20 | 0.37 |
| ▸ | CA6 | P23280 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29904429 | 0.79 | POLB (0.41) | ALDH1A1HPGDSMN1; SMN2EPHX2KDM4E | |
| SCHEMBL8751745 | 0.76 | CES2 (0.43) | ALDH1A1TSHRGAAKMT2ARECQL | |
| SCHEMBL1743909 | 0.72 | EPHX2 (0.43) | ALDH1A1SMN1; SMN2TSHRALOX12EPHX2 | |
| SCHEMBL7962771 | 0.71 | TSHR (0.43) | ALDH1A1HPGDHSD17B10SMN1; SMN2TSHR | |
| SCHEMBL9404042 | 0.70 | ALDH1A1 (0.51) | ALDH1A1CYP2C19SMN1; SMN2TSHRALOX12 | |
| SCHEMBL17221973 | 0.69 | GAA (0.45) | ALDH1A1HPGDHSD17B10CYP2C19SMN1; SMN2 | |
| SCHEMBL6549890 | 0.69 | CA2 (0.52) | ALDH1A1HPGDHSD17B10SMN1; SMN2TSHR | |
| SCHEMBL928962 | 0.69 | ALDH1A1 (0.46) | ALDH1A1HSD17B10SMN1; SMN2TSHREPHX2 | |
| SCHEMBL207711 | 0.68 | CES2 (0.45) | ALDH1A1TSHREPHX2 | |
| SCHEMBL11586847 | 0.68 | EPHX2 (0.56) | ALDH1A1HPGDUSP2CYP2C19SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4091000-A1 | DRY FILM | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2022-11-23 | — | — | EP | disclosed |
| WO-2021067547-A1 | PLANARIZING PROCESS AND COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2021-04-08 | — | — | WO | disclosed |
| EP-3639293-A1 | MULTILAYER STRUCTURE | FUJIFILM Electronic Materials U.S.A., Inc. (US) | 2020-04-22 | — | — | EP | disclosed |
| EP-3478777-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM Electronic Materials U.S.A., Inc. (US) | 2019-05-08 | — | — | EP | disclosed |
| EP-3478482-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2019-05-08 | — | — | EP | disclosed |
| WO-2019050566-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2019-03-14 | — | — | WO | disclosed |
| WO-2019050565-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2019-03-14 | — | — | WO | disclosed |
| EP-3417010-A1 | POLYIMIDES | FujiFilm Electronic Materials USA, Inc. (US) | 2018-12-26 | — | — | EP | disclosed |
| EP-3417011-A1 | POLYIMIDES | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2018-12-26 | — | — | EP | disclosed |
| EP-3417000-A1 | POLYIMIDES | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2018-12-26 | — | — | EP | disclosed |
| EP-1509814-A2 | ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | Arch Specialty Chemicals, Inc. (US) | 2005-03-02 | — | — | EP | disclosed |
| WO-2005000912-A2 | NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2005-01-06 | — | — | WO | disclosed |
| WO-2004111726-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2004-12-23 | — | — | WO | disclosed |
| WO-2004081664-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-09-23 | — | — | WO | disclosed |
| WO-2004055592-A2 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |
| WO-2004055593-A2 | PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |
| WO-2003099782-A2 | ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-12-04 | — | — | WO | disclosed |
| EP-0579420-B1 | Negative working resist material and pattern forming process | WAKO PURE CHEM IND LTD (JP) | 1997-03-05 | — | — | EP | disclosed |
| US-5389491-A | Negative working resist composition | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1995-02-14 | — | — | US | disclosed |
| EP-0579420-A2 | Negative working resist material and pattern forming process | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1994-01-19 | — | — | EP | disclosed |