Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX2 | P34913 | 1/20 | 0.43 |
| ▸ | THRB | P10828 | 1/20 | 0.41 |
| ▸ | P2RX7 | Q99572 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | CNR1 | P21554 | 4/20 | 0.35 |
| ▸ | PKM | P14618 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | ATM | Q13315 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29904429 | 0.81 | POLB (0.41) | EPHX2NPC1RAB9AALDH1A1POLB | |
| SCHEMBL928962 | 0.78 | ALDH1A1 (0.46) | EPHX2TSHRNPC1RAB9AALDH1A1 | |
| SCHEMBL7693577 | 0.76 | ENPP3 (0.39) | TSHRNPC1ALDH1A1POLBSMN1; SMN2 | |
| SCHEMBL27503502 | 0.76 | EPHX2 (0.39) | EPHX2THRBP2RX7TSHRL3MBTL1 | |
| SCHEMBL8751838 | 0.75 | ENPP3 (0.46) | EPHX2NPC1RAB9AALDH1A1 | |
| SCHEMBL7962765 | 0.75 | ALDH1A1 (0.37) | ALDH1A1ALOX12HTTPOLBMEN1 | |
| SCHEMBL8751784 | 0.72 | CES2 (0.43) | TSHRSMN1; SMN2 | |
| SCHEMBL1743908 | 0.72 | ALDH1A1 (0.42) | EPHX2TSHRALDH1A1ALOX12HTT | |
| SCHEMBL7696102 | 0.71 | ENPP3 (0.52) | POLB | |
| SCHEMBL7722429 | 0.71 | POLB (0.46) | EPHX2TSHRALDH1A1HTTPOLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4091000-A1 | DRY FILM | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2022-11-23 | — | — | EP | disclosed |
| WO-2021067547-A1 | PLANARIZING PROCESS AND COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2021-04-08 | — | — | WO | disclosed |
| EP-3639293-A1 | MULTILAYER STRUCTURE | FUJIFILM Electronic Materials U.S.A., Inc. (US) | 2020-04-22 | — | — | EP | disclosed |
| EP-3478482-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2019-05-08 | — | — | EP | disclosed |
| EP-3478777-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM Electronic Materials U.S.A., Inc. (US) | 2019-05-08 | — | — | EP | disclosed |
| WO-2019050566-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2019-03-14 | — | — | WO | disclosed |
| WO-2019050565-A1 | DIELECTRIC FILM FORMING COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2019-03-14 | — | — | WO | disclosed |
| EP-3417000-A1 | POLYIMIDES | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2018-12-26 | — | — | EP | disclosed |
| EP-3417011-A1 | POLYIMIDES | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2018-12-26 | — | — | EP | disclosed |
| EP-3417010-A1 | POLYIMIDES | FujiFilm Electronic Materials USA, Inc. (US) | 2018-12-26 | — | — | EP | disclosed |
| EP-1609024-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | Fujifilm Electronic Materials USA, Inc. (US) | 2005-12-28 | — | — | EP | disclosed |
| WO-2005089150-A2 | THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS USA INC. (US) | 2005-09-29 | — | — | WO | disclosed |
| EP-1579272-A2 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS | Fujifilm Electronic Materials USA, Inc. (US) | 2005-09-28 | — | — | EP | disclosed |
| EP-1509814-A2 | ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | Arch Specialty Chemicals, Inc. (US) | 2005-03-02 | — | — | EP | disclosed |
| WO-2005000912-A2 | NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2005-01-06 | — | — | WO | disclosed |
| WO-2004111726-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2004-12-23 | — | — | WO | disclosed |
| WO-2004081664-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-09-23 | — | — | WO | disclosed |
| WO-2004055592-A2 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |
| WO-2004055593-A2 | PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |
| WO-2003099782-A2 | ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-12-04 | — | — | WO | disclosed |