SCHEMBL17736500

SCHEMBL17736500

CC(C)(C)C(=O)/C(=N\OS(=O)(=O)C12CC3CC(CC(C3)C1)C2)c1nc2ccccc2o1

nearest known ligand 0.39

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
▸ XDH P47989 11/20 0.39
▸ HSF1 Q00613 3/20 0.36
▸ NPC1 O15118 1/20 0.36
▸ TNF P01375 1/20 0.36
▸ RAB9A P51151 1/20 0.36
▸ NLRP3 Q96P20 3/20 0.36
▸ TLR4 O00206 1/20 0.36
▸ FAAH O00519 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17736490 0.82 CYP1A2 (0.38) XDHHSF1FAAH
SCHEMBL17736503 0.80 CYP1A2 (0.37) XDHHSF1NLRP3TLR4
SCHEMBL17736496 0.80 CNR1 (0.48) NPC1RAB9A
SCHEMBL16381780 0.76 XDH (0.50) XDHHSF1NPC1TNFRAB9A
SCHEMBL17736504 0.74 FAAH (0.40) XDHNLRP3FAAH
SCHEMBL17736498 0.73 FAAH (0.39) XDHHSF1NPC1TNFRAB9A
SCHEMBL17736493 0.72 XDH (0.34) XDHHSF1NPC1TNFRAB9A
SCHEMBL17736497 0.72 XDH (0.37) XDHHSF1NPC1TNFRAB9A
SCHEMBL17341928 0.71 XDH (0.49) XDHHSF1NPC1TNFRAB9A
SCHEMBL17341906 0.70 XDH (0.43) XDHHSF1NPC1TNFRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160131976-A1 RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-05-12 — — US disclosed
US-20160131976-A1 RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-05-12 — — US disclosed
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