SCHEMBL1781213

SCHEMBL1781213

C=CCC[SiH](Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
KCNA3 P22001 1/20 0.37
THRB P10828 1/20 0.36
SMN1; SMN2 Q16637 3/20 0.36
KDM4E B2RXH2 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
RAB9A P51151 2/20 0.34
GLA P06280 1/20 0.34
GAA P10253 1/20 0.34
HTT P42858 1/20 0.34
TAAR1 Q96RJ0 1/20 0.33
RECQL P46063 1/20 0.33
AOC3 Q16853 1/20 0.33
PKM P14618 1/20 0.32
ALOX15 P16050 1/20 0.32
LTA4H P09960 2/20 0.32
TSHR P16473 1/20 0.32
CASP1 P29466 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2168159 0.89 ALDH1A1 (0.40) ALDH1A1L3MBTL1KCNA3THRBSMN1; SMN2
SCHEMBL1782417 0.79 THRB (0.38) ALDH1A1L3MBTL1KCNA3THRBSMN1; SMN2
SCHEMBL2229313 0.77 LTA4H (0.36) ALDH1A1KCNA3SMN1; SMN2RAB9ATAAR1
SCHEMBL9496214 0.73 ALDH1A1 (0.37) ALDH1A1L3MBTL1KCNA3THRBSMN1; SMN2
SCHEMBL712986 0.72 LTA4H (0.41) L3MBTL1KCNA3LTA4HTSHR
Allylanisole SCHEMBL4737421 0.72 KCNA3 (0.58) ALDH1A1L3MBTL1KCNA3THRBSMN1; SMN2
SCHEMBL4354693 0.72 LTA4H (0.36) ALDH1A1L3MBTL1KCNA3SMN1; SMN2RAB9A
SCHEMBL4363258 0.72 KCNA3 (0.37) ALDH1A1KCNA3PKMLTA4HTSHR
SCHEMBL704612 0.71 ALDH1A1 (0.41) ALDH1A1SMN1; SMN2RAB9AGAATAAR1
SCHEMBL7980722 0.71 ALDH1A1 (0.62) ALDH1A1L3MBTL1KCNA3THRBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
EP-3971229-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-23 EP disclosed
EP-3957678-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER Tokyo Ohka Kogyo Co., Ltd. (JP) 2022-02-23 EP disclosed
WO-2020235325-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER 東京応化工業株式会社 (JP) 2020-11-26 WO disclosed
US-20200362115-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA-BASED COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-19 US disclosed
WO-2020230828-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER 東京応化工業株式会社 2020-11-19 WO disclosed
EP-1950239-B1 TRANSPARENT INORGANIC-OXIDE DISPERSION, RESIN COMPOSITION CONTAINING INORGANIC OXIDE PARTICLES, COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT, LUMINESCENT ELEMENT, HARD COAT, OPTICAL FUNCTIONAL FILM, OPTICAL PART, AND PROCESS FOR PRODUCING RESIN COMPOSITION CONTAINING INORGANIC OXIDE PARTICLES SUMITOMO OSAKA CEMENT CO LTD (JP) 2017-01-04 EP disclosed
US-8247590-B2 Method for preventing polymerization of unsaturated organosilicon compounds WACKER CHEMIE AG (DE) 2012-08-21 US disclosed
US-7985476-B2 Transparent zirconia dispersion and zirconia particle-containing resin composition, composition for sealing light emitting element and light emitting element, hard coat film and optical functional film and optical component, and method for producing zirconia particle-containing resin SUMITOMO OSAKA CEMENT CO., LTD. (JP) 2011-07-26 US disclosed
US-20110118493-A1 METHOD FOR PREVENTING POLYMERIZATION OF UNSATURATED ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2011-05-19 US disclosed
US-20090140284-A1 Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin SUMITOMO OSAKA CEMENT CO., LTD. (JP) 2009-06-04 US disclosed
EP-1950239-A1 TRANSPARENT INORGANIC-OXIDE DISPERSION, RESIN COMPOSITION CONTAINING INORGANIC OXIDE PARTICLES, COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT, LUMINESCENT ELEMENT, HARD COAT, OPTICAL FUNCTIONAL FILM, OPTICAL PART, AND PROCESS FOR PRODUCING RESIN COMPOSITION CONTAINING INORGANIC OXIDE PARTICLES SUMITOMO OSAKA CEMENT CO., LTD. (JP) 2008-07-30 EP disclosed
US-7291567-B2 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2007-11-06 US disclosed
EP-1619226-A1 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR Corporation (JP) 2006-01-25 EP disclosed