SCHEMBL18123023

SCHEMBL18123023

CC(=O)O/N=C(/C(=O)c1ccc2c(c1)C(CCC(F)(F)F)(CCC(F)(F)F)c1ccccc1-2)c1ccccc1C

nearest known ligand 0.38

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ PDK2 Q15119 19/20 0.38
▸ NPC1 O15118 1/20 0.32
▸ POLB P06746 1/20 0.32
▸ RAB9A P51151 1/20 0.32
▸ KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18926234 0.97 PDK2 (0.35) PDK2
SCHEMBL18123026 0.91 PDK2 (0.35) PDK2NPC1POLBRAB9AKMT2A
SCHEMBL26443682 0.89 PDK2 (0.33) PDK2NPC1POLBRAB9AKMT2A
SCHEMBL18123006 0.89 PDK2 (0.33) PDK2NPC1POLBRAB9AKMT2A
SCHEMBL18123031 0.89 PDK2 (0.40) PDK2
SCHEMBL18926237 0.88 PDK2 (0.33) PDK2
SCHEMBL18123024 0.88 PDK2 (0.33) PDK2NPC1POLBRAB9AKMT2A
SCHEMBL18123018 0.88 PDK2 (0.33) PDK2NPC1POLBRAB9AKMT2A
SCHEMBL18838804 0.88 PDK2 (0.38) PDK2
SCHEMBL18123032 0.87 PDK2 (0.33) PDK2NPC1POLBRAB9AKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 — — US disclosed
WO-2023047856-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-03-30 — — WO disclosed
US-20230056225-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-23 — — US disclosed
US-20230038195-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-09 — — US disclosed
US-20230028822-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-26 — — US disclosed
US-20230002520-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-05 — — US disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 — — US disclosed
US-20220404709-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2022-12-22 — — US disclosed
WO-2022181562-A1 PHOTOCURABLE LIQUID COMPOSITION, CURED OBJECT, AND METHOD FOR PRODUCING CURED OBJECT 東京応化工業株式会社 2022-09-01 — — WO disclosed
US-20190094692-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE, AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2019-03-28 — — US disclosed
US-10023540-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-17 — — US disclosed
US-20180187010-A1 SILICON-CONTAINING RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-05 — — US disclosed
US-9981914-B2 — — 2018-05-29 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 — — EP disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
WO-2017007010-A1 SILICON-CONTAINING RESIN COMPOSITION 東京応化工業株式会社 2017-01-12 — — WO disclosed
WO-2016158679-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2016-10-06 — — WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM RARA, LCP1, CUTA PDK2 4505/4885NPC1 2823/4885POLB 3523/4885
US-20180187010-A1 SILICON-CONTAINING RESIN COMPOSITION CROCC, SRI, SEM1 PDK2 4736/4885NPC1 2951/4885POLB 828/4885
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT SLC9A2, SLC9A1, NHERF1 PDK2 2563/4885NPC1 2457/4885POLB 2120/4885
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND C1R, CRY1, C1S PDK2 2998/4885NPC1 1861/4885POLB 2561/4885
US-10023540-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element SLC9A2, SLC9A1, NHERF1 PDK2 2563/4885NPC1 2457/4885POLB 2120/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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