SCHEMBL18123030

SCHEMBL18123030

CCCC1(CCC)c2ccccc2-c2ccc(C(=O)/C(CCC(=O)OC)=N/OC(C)=O)cc21

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ PDK2 Q15119 15/20 0.35
▸ APEX1 P27695 1/20 0.35
▸ PTPRC P08575 1/20 0.33
▸ ESRRB O95718 1/20 0.33
▸ ALDH1A1 P00352 1/20 0.32
▸ MAPT P10636 1/20 0.32
▸ ITGA4 P13612 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18123028 0.91 PDK2 (0.38) PDK2APEX1ALDH1A1
SCHEMBL18123021 0.89 PDK2 (0.38) PDK2APEX1ALDH1A1MAPT
SCHEMBL18123022 0.88 APEX1 (0.34) PDK2APEX1ALDH1A1MAPT
SCHEMBL18812925 0.88 PDK2 (0.38) PDK2APEX1PTPRCESRRBALDH1A1
SCHEMBL18838969 0.88 PDK2 (0.38) PDK2APEX1PTPRCESRRBALDH1A1
SCHEMBL18812926 0.88 PDK2 (0.38) PDK2APEX1PTPRCESRRBALDH1A1
SCHEMBL24490485 0.87 PDK2 (0.36) PDK2APEX1
SCHEMBL24490462 0.87 PDK2 (0.36) PDK2APEX1
SCHEMBL23895114 0.85 APEX1 (0.34) PDK2APEX1MAPT
SCHEMBL21431267 0.84 CYP2C19 (0.31) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 — — US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 — — US disclosed
WO-2023127402-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023127401-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023120077-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023120076-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023074266-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
WO-2023074264-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
US-20180113383-A1 COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-26 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 — — EP disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
WO-2017007010-A1 SILICON-CONTAINING RESIN COMPOSITION 東京応化工業株式会社 2017-01-12 — — WO disclosed
WO-2016158679-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2016-10-06 — — WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM RARA, LCP1, CUTA PDK2 4505/4885APEX1 2902/4885PTPRC 3171/4885
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT SLC9A2, SLC9A1, NHERF1 PDK2 2563/4885APEX1 365/4885PTPRC 4569/4885
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND C1R, CRY1, C1S PDK2 2998/4885APEX1 871/4885PTPRC 3054/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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