SCHEMBL18360374

SCHEMBL18360374

O=C(O)CN(CC(=O)O)c1ccc(Cc2ccc(N(CC(=O)O)CC(=O)O)cc2)cc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.44
ALDH1A1 P00352 4/20 0.43
CYP3A4 P08684 4/20 0.43
TDP1 Q9NUW8 3/20 0.43
TSHR P16473 2/20 0.43
MAPK1 P28482 1/20 0.43
LMNA P02545 4/20 0.42
SMN1; SMN2 Q16637 3/20 0.42
HIF1A Q16665 3/20 0.42
MAPT P10636 2/20 0.42
NFKB1 P19838 2/20 0.42
THPO P40225 2/20 0.42
PMP22 Q01453 2/20 0.42
GMNN O75496 1/20 0.42
CYP2D6 P10635 1/20 0.42
GABRA1 P14867 1/20 0.42
GABRA2 P47869 1/20 0.42
GABRB2 P47870 1/20 0.42
SLCO1B3 Q9NPD5 1/20 0.42
HDAC1 Q13547 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7635507 0.94 LMNA (0.48) POLBTDP1LMNALTA4HPLA2G2A
SCHEMBL12311123 0.91 ALDH1A1 (0.61) ALDH1A1CYP3A4TDP1TSHRMAPK1
SCHEMBL8038936 0.89 TDP1 (0.44) ALDH1A1TDP1TSHRLMNASMN1; SMN2
SCHEMBL13647724 0.85 ALDH1A1 (0.41) ALDH1A1CYP3A4TDP1TSHRLMNA
SCHEMBL18719869 0.85 LTA4H (0.35) POLBALDH1A1CYP3A4TDP1TSHR
SCHEMBL339416 0.83 ALDH1A1 (0.50) POLBALDH1A1TSHRLMNASMN1; SMN2
SCHEMBL7637806 0.82 TSHR (0.46) ALDH1A1TDP1TSHRLMNASMN1; SMN2
SCHEMBL13645018 0.80 CA2 (0.46) POLBALDH1A1CYP3A4TDP1LMNA
SCHEMBL202173 0.79 TDP1 (0.50) POLBALDH1A1CYP3A4TDP1TSHR
SCHEMBL342255 0.79 ALDH1A1 (0.59) POLBALDH1A1TDP1MAPK1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230333477-A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-10-19 US disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
EP-3162868-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2017-05-03 EP disclosed
US-20170101521-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2017-04-13 US disclosed
WO-2017038664-A1 COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2017-03-09 WO disclosed
WO-2017002859-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2017-01-05 WO disclosed