SCHEMBL19054885

SCHEMBL19054885

COC(=O)CC(c1ccc(OC)cc1)n1ccnc1

nearest known ligand 0.58

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 3/20 0.58
KMT2A Q03164 3/20 0.58
CYP24A1 Q07973 4/20 0.56
CYP26A1 O43174 2/20 0.54
RAB9A P51151 2/20 0.53
MAPT P10636 2/20 0.53
CYP17A1 P05093 3/20 0.50
MEN1 O00255 1/20 0.48
NPC1 O15118 1/20 0.48
TP53 P04637 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
ALDH1A1 P00352 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
LMNA P02545 1/20 0.47
HPGD P15428 1/20 0.46
HTT P42858 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21419663 0.90 CYP19A1 (0.56) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL20390011 0.89 CYP19A1 (0.54) CYP19A1KMT2ACYP24A1CYP26A1CYP17A1
SCHEMBL18123005 0.88 CYP19A1 (0.59) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL20830319 0.88 CYP19A1 (0.59) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL20390014 0.88 CYP17A1 (0.51) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL22241533 0.87 CYP19A1 (0.58) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL19054884 0.87 MAPT (0.56) CYP24A1CYP26A1RAB9AMAPTCYP17A1
SCHEMBL20390008 0.86 MAPT (0.47) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL21419653 0.82 CYP19A1 (0.47) CYP19A1KMT2ACYP24A1CYP26A1RAB9A
SCHEMBL22241536 0.81 CYP19A1 (0.46) CYP19A1KMT2ACYP24A1CYP26A1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-08 US disclosed
US-11142629-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-12 US disclosed
US-20200283567-A1 COMPOUND, EPOXY CURING CATALYST AND METHOD FOR PRODUCING COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2020-09-10 US disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-10570269-B2 Composition containing microparticles TOKYO OHKA KOGYO CO., LTD. (JP) 2020-02-25 US disclosed
US-20190300674-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2019-10-03 US disclosed
US-10364372-B2 Composition and method of producing siliceous film TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-30 US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
EP-3514145-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2019-07-24 EP disclosed
US-10336708-B2 Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-02 US disclosed
US-20180201807-A1 COMPOSITION AND METHOD OF PRODUCING SILICEOUS FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-19 US disclosed
US-20180201807-A1 COMPOSITION AND METHOD OF PRODUCING SILICEOUS FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-19 US disclosed
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-12 US disclosed
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-12 US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
EP-3184511-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-06-28 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10336708-B2 Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method FASN, SLC27A1, SLC27A2 CYP19A1 1211/4885KMT2A 1187/4885CYP24A1 1784/4885
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES CHMP4B, EXOSC10, EXOSC9 CYP19A1 4154/4885KMT2A 3532/4885CYP24A1 3200/4885
US-20200283567-A1 COMPOUND, EPOXY CURING CATALYST AND METHOD FOR PRODUCING COMPOUND MSMO1, RIOK1, ME1 CYP19A1 396/4885KMT2A 1027/4885CYP24A1 2215/4885
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD FASN, SLC27A1, SLC27A2 CYP19A1 1211/4885KMT2A 1187/4885CYP24A1 1784/4885
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound MSMO1, RIOK1, ME1 CYP19A1 396/4885KMT2A 1027/4885CYP24A1 2215/4885
US-10570269-B2 Composition containing microparticles CHMP4B, EXOSC10, EXOSC9 CYP19A1 4154/4885KMT2A 3532/4885CYP24A1 3200/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.