SCHEMBL18123005

SCHEMBL18123005

COc1ccc(C(CC(=O)O)n2ccnc2)cc1

nearest known ligand 0.59

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 4/20 0.59
CYP24A1 Q07973 4/20 0.57
KMT2A Q03164 4/20 0.56
ATM Q13315 1/20 0.55
CYP26A1 O43174 1/20 0.52
CYP17A1 P05093 5/20 0.51
MEN1 O00255 1/20 0.47
NPC1 O15118 1/20 0.47
TP53 P04637 1/20 0.47
RAB9A P51151 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
ALDH1A1 P00352 1/20 0.46
MAPT P10636 1/20 0.46
TDP1 Q9NUW8 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20830319 1.00 CYP19A1 (0.59) CYP19A1CYP24A1KMT2AATMCYP26A1
SCHEMBL22241533 0.88 CYP19A1 (0.58) CYP19A1CYP24A1KMT2ACYP26A1CYP17A1
SCHEMBL19054885 0.88 CYP19A1 (0.58) CYP19A1CYP24A1KMT2ACYP26A1CYP17A1
SCHEMBL18516675 0.86 CYP17A1 (0.50) CYP19A1CYP24A1KMT2AATMCYP26A1
SCHEMBL19054886 0.86 CYP19A1 (0.55) CYP19A1CYP26A1CYP17A1SMN1; SMN2TDP1
SCHEMBL21419663 0.86 CYP19A1 (0.56) CYP19A1CYP24A1KMT2ACYP26A1CYP17A1
SCHEMBL19999185 0.86 CYP17A1 (0.50) CYP19A1CYP24A1KMT2ACYP26A1CYP17A1
SCHEMBL19054889 0.86 CYP17A1 (0.50) CYP19A1CYP24A1CYP17A1SMN1; SMN2TDP1
SCHEMBL20390011 0.85 CYP19A1 (0.54) CYP19A1CYP24A1KMT2ACYP26A1CYP17A1
SCHEMBL20390007 0.84 CYP17A1 (0.46) CYP19A1CYP24A1CYP26A1CYP17A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368287-B Tetracarboxylic dianhydride, polyimide precursor resin, polyimide precursor resin solution, polyimide solution and polyimide film 引能仕株式会社 2024-01-09 CN disclosed
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-08 US disclosed
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-08 US disclosed
WO-2021220919-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 2021-11-04 WO disclosed
WO-2021220920-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, SOLID PRODUCT, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 (JP) 2021-11-04 WO disclosed
US-11142629-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-12 US disclosed
US-11136435-B2 Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition ENEOS CORPORATION (JP) 2021-10-05 US disclosed
US-11111397-B2 Silica-based film-forming composition, method of producing substrate including silica-based film, and additive added to silica-based film-forming composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-09-07 US disclosed
US-10954340-B2 Polyimide precursor composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-23 US disclosed
CN-112368287-A Tetracarboxylic dianhydride, polyimide precursor resin, polyimide precursor resin solution, polyimide solution, and polyimide film 引能仕株式会社 2021-02-12 CN disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 US disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 US disclosed
EP-3228641-A1 CURABLE COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-10-11 EP disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
EP-3184511-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-06-28 EP disclosed
WO-2017026448-A1 POLYIMIDE PRECURSOR COMPOSITION 東京応化工業株式会社 2017-02-16 WO disclosed
WO-2016158679-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2016-10-06 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT SLC9A2, SLC9A1, NHERF1 CYP19A1 820/4885CYP24A1 3411/4885KMT2A 1420/4885
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD FASN, SLC27A1, SLC27A2 CYP19A1 1211/4885CYP24A1 1784/4885KMT2A 1187/4885
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound MSMO1, RIOK1, ME1 CYP19A1 396/4885CYP24A1 2215/4885KMT2A 1027/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.