SCHEMBL19054892

SCHEMBL19054892

O=C(O)CC(c1ccc(-c2ccccc2)cc1)n1ccnc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP17A1 P05093 16/20 0.68
▸ MEN1 O00255 1/20 0.58
▸ NR1I2 O75469 1/20 0.58
▸ USP2 O75604 1/20 0.58
▸ ABCB11 O95342 1/20 0.58
▸ ALDH1A1 P00352 1/20 0.58
▸ PLA2G1B P04054 1/20 0.58
▸ TP53 P04637 1/20 0.58
▸ PGR P06401 1/20 0.58
▸ HSP90AA1 P07900 1/20 0.58
▸ CYP3A4 P08684 1/20 0.58
▸ MAPT P10636 1/20 0.58
▸ IDO1 P14902 1/20 0.58
▸ HPGD P15428 1/20 0.58
▸ MAOA P21397 1/20 0.58
▸ CNR1 P21554 1/20 0.58
▸ HTR2A P28223 1/20 0.58
▸ MAPK1 P28482 1/20 0.58
▸ ADRA1A P35348 1/20 0.58
▸ OPRK1 P41145 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6983161 0.91 CYP24A1 (0.56) CYP17A1TDP1CYP27B1CYP24A1CYP19A1
SCHEMBL21976264 0.86 CYP26A1 (0.60) CYP17A1CYP24A1
SCHEMBL19054886 0.86 CYP19A1 (0.55) CYP17A1TDP1CYP19A1
SCHEMBL19054889 0.85 CYP17A1 (0.50) CYP17A1TDP1CYP27B1CYP24A1CYP19A1
SCHEMBL20830319 0.81 CYP19A1 (0.59) CYP17A1MEN1ALDH1A1TP53MAPT
SCHEMBL18123005 0.81 CYP19A1 (0.59) CYP17A1MEN1ALDH1A1TP53MAPT
SCHEMBL410598 0.80 CYP17A1 (0.56) CYP17A1CYP27B1CYP24A1CYP19A1
SCHEMBL31060651 0.80 CYP17A1 (1.00) CYP17A1MEN1NR1I2USP2ABCB11
SCHEMBL21976265 0.80 CYP26A1 (0.66) CYP3A4CYP24A1
SCHEMBL19999185 0.78 CYP17A1 (0.50) CYP17A1MEN1CYP3A4ADRA1AKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-08 — — US disclosed
WO-2021220919-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 2021-11-04 — — WO disclosed
WO-2021220920-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, SOLID PRODUCT, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 (JP) 2021-11-04 — — WO disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 — — US disclosed
US-20200139433-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE FINE PARTICLE, METHOD FOR PRODUCING IMPROVED METAL OXIDE FINE PARTICLES, SURFACE-MODIFIED METAL OXIDE FINE PARTICLES, AND METAL OXIDE FINE PARTICLE DISPERSION LIQUID TOKYO OHKA KOGYO CO., LTD. (JP) 2020-05-07 — — US disclosed
US-10570269-B2 Composition containing microparticles TOKYO OHKA KOGYO CO., LTD. (JP) 2020-02-25 — — US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 — — US disclosed
EP-3514145-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2019-07-24 — — EP disclosed
US-10336708-B2 Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-02 — — US disclosed
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-12 — — US disclosed
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-12 — — US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 — — US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 — — US disclosed
EP-3184511-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-06-28 — — EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10336708-B2 Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method FASN, SLC27A1, SLC27A2 CYP17A1 1258/4885MEN1 2674/4885NR1I2 2421/4885
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES CHMP4B, EXOSC10, EXOSC9 CYP17A1 4321/4885MEN1 200/4885NR1I2 4429/4885
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD FASN, SLC27A1, SLC27A2 CYP17A1 1258/4885MEN1 2674/4885NR1I2 2421/4885
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound MSMO1, RIOK1, ME1 CYP17A1 369/4885MEN1 507/4885NR1I2 1155/4885
US-10570269-B2 Composition containing microparticles CHMP4B, EXOSC10, EXOSC9 CYP17A1 4321/4885MEN1 200/4885NR1I2 4429/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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