SCHEMBL19054889

SCHEMBL19054889

O=C(O)CC(c1ccc(Oc2ccccc2)cc1)n1ccnc1

nearest known ligand 0.53

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP17A1 P05093 6/20 0.50
CYP24A1 Q07973 8/20 0.48
HSD17B10 Q99714 1/20 0.47
POLB P06746 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
CYP19A1 P11511 2/20 0.44
CYP27B1 O15528 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6983161 0.88 CYP24A1 (0.56) CYP17A1CYP24A1HSD17B10POLBSMN1; SMN2
SCHEMBL20830319 0.86 CYP19A1 (0.59) CYP17A1CYP24A1SMN1; SMN2TDP1CYP19A1
SCHEMBL18123005 0.86 CYP19A1 (0.59) CYP17A1CYP24A1SMN1; SMN2TDP1CYP19A1
SCHEMBL19054892 0.85 CYP17A1 (0.68) CYP17A1CYP24A1TDP1CYP19A1CYP27B1
SCHEMBL21976264 0.83 CYP26A1 (0.60) CYP17A1CYP24A1
SCHEMBL19999185 0.82 CYP17A1 (0.50) CYP17A1CYP24A1CYP19A1
SCHEMBL19054886 0.82 CYP19A1 (0.55) CYP17A1HSD17B10POLBSMN1; SMN2TDP1
SCHEMBL20390007 0.81 CYP17A1 (0.46) CYP17A1CYP24A1SMN1; SMN2CYP19A1
SCHEMBL21419726 0.79 MMP9 (0.55) CYP17A1POLBSMN1; SMN2TDP1CYP19A1
SCHEMBL21419727 0.79 MMP9 (0.55) CYP17A1POLBSMN1; SMN2TDP1CYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-08 US disclosed
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-08 US disclosed
WO-2021220919-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 2021-11-04 WO disclosed
WO-2021220920-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, SOLID PRODUCT, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 (JP) 2021-11-04 WO disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-20200139433-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE FINE PARTICLE, METHOD FOR PRODUCING IMPROVED METAL OXIDE FINE PARTICLES, SURFACE-MODIFIED METAL OXIDE FINE PARTICLES, AND METAL OXIDE FINE PARTICLE DISPERSION LIQUID TOKYO OHKA KOGYO CO., LTD. (JP) 2020-05-07 US disclosed
US-10570269-B2 Composition containing microparticles TOKYO OHKA KOGYO CO., LTD. (JP) 2020-02-25 US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
US-10336708-B2 Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-02 US disclosed
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-12 US disclosed
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-12 US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
EP-3184511-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-06-28 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10336708-B2 Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method FASN, SLC27A1, SLC27A2 CYP17A1 1258/4885CYP24A1 1784/4885HSD17B10 555/4885
US-20180194930-A1 COMPOSITION CONTAINING MICROPARTICLES CHMP4B, EXOSC10, EXOSC9 CYP17A1 4321/4885CYP24A1 3200/4885HSD17B10 4476/4885
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD FASN, SLC27A1, SLC27A2 CYP17A1 1258/4885CYP24A1 1784/4885HSD17B10 555/4885
US-11718587-B2 Compound, epoxy curing catalyst and method for producing compound MSMO1, RIOK1, ME1 CYP17A1 369/4885CYP24A1 2215/4885HSD17B10 2419/4885
US-10570269-B2 Composition containing microparticles CHMP4B, EXOSC10, EXOSC9 CYP17A1 4321/4885CYP24A1 3200/4885HSD17B10 4476/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.