SCHEMBL6983161

SCHEMBL6983161

O=C(O)CC(c1ccccc1)n1ccnc1

nearest known ligand 0.66

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CYP24A1 Q07973 9/20 0.56
CYP19A1 P11511 1/20 0.56
CYP17A1 P05093 4/20 0.55
CYP27B1 O15528 2/20 0.53
HSD17B10 Q99714 1/20 0.51
POLB P06746 1/20 0.51
SMN1; SMN2 Q16637 1/20 0.51
TDP1 Q9NUW8 1/20 0.51
HMOX2 P30519 1/20 0.51
KDM4E B2RXH2 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19054892 0.91 CYP17A1 (0.68) CYP24A1CYP19A1CYP17A1CYP27B1TDP1
SCHEMBL21976264 0.89 CYP26A1 (0.60) CYP24A1CYP17A1KDM4E
SCHEMBL19054886 0.88 CYP19A1 (0.55) CYP19A1CYP17A1HSD17B10POLBSMN1; SMN2
SCHEMBL410598 0.88 CYP17A1 (0.56) CYP24A1CYP19A1CYP17A1CYP27B1HMOX2
SCHEMBL19054889 0.88 CYP17A1 (0.50) CYP24A1CYP19A1CYP17A1CYP27B1HSD17B10
SCHEMBL19054884 0.84 MAPT (0.56) CYP24A1CYP17A1CYP27B1KDM4E
SCHEMBL20830319 0.83 CYP19A1 (0.59) CYP24A1CYP19A1CYP17A1SMN1; SMN2TDP1
SCHEMBL18123005 0.83 CYP19A1 (0.59) CYP24A1CYP19A1CYP17A1SMN1; SMN2TDP1
SCHEMBL7122603 0.82 CYP17A1 (0.53) CYP24A1CYP19A1CYP17A1CYP27B1KDM4E
SCHEMBL6949630 0.82 CYP19A1 (0.61) CYP24A1CYP19A1CYP17A1CYP27B1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368287-B Tetracarboxylic dianhydride, polyimide precursor resin, polyimide precursor resin solution, polyimide solution and polyimide film 引能仕株式会社 2024-01-09 CN disclosed
WO-2021220920-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, SOLID PRODUCT, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 (JP) 2021-11-04 WO disclosed
WO-2021220919-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLES, METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE MICROPARTICLE DISPERSION, AND METHOD FOR PRODUCING SOLID PRODUCT 東京応化工業株式会社 2021-11-04 WO disclosed
US-10954340-B2 Polyimide precursor composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-23 US disclosed
CN-112368287-A Tetracarboxylic dianhydride, polyimide precursor resin, polyimide precursor resin solution, polyimide solution, and polyimide film 引能仕株式会社 2021-02-12 CN disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-10570269-B2 Composition containing microparticles TOKYO OHKA KOGYO CO., LTD. (JP) 2020-02-25 US disclosed
WO-2020027249-A1 TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE PRECURSOR RESIN, POLYIMIDE, POLYIMIDE PRECURSOR RESIN SOLUTION, POLYIMIDE SOLUTION, AND POLYIMIDE FILM JXTGエネルギー株式会社 2020-02-06 WO disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 US disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 US disclosed
EP-3228641-A1 CURABLE COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-10-11 EP disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 US disclosed
EP-3184511-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-06-28 EP disclosed
WO-2017026448-A1 POLYIMIDE PRECURSOR COMPOSITION 東京応化工業株式会社 2017-02-16 WO disclosed
WO-2016158679-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2016-10-06 WO disclosed
EP-1346992-A1 Quinazoline derivatives, process for their preparation and pharmaceutical compositions containing them Les Laboratoires Servier (FR) 2003-09-24 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD FASN, SLC27A1, SLC27A2 CYP24A1 1784/4885CYP19A1 1211/4885CYP17A1 1258/4885
US-10570269-B2 Composition containing microparticles CHMP4B, EXOSC10, EXOSC9 CYP24A1 3200/4885CYP19A1 4154/4885CYP17A1 4321/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.