SCHEMBL1908275

SCHEMBL1908275

C=Cc1ccccc1OC(=O)CCCCC

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.55
MEN1 O00255 1/20 0.55
RECQL P46063 1/20 0.55
KMT2A Q03164 1/20 0.55
POLM Q9NP87 2/20 0.50
POLK Q9UBT6 2/20 0.50
POLL Q9UGP5 2/20 0.50
POLH Q9Y253 2/20 0.50
ALOX15 P16050 1/20 0.50
PPARG P37231 4/20 0.47
THRA P10827 1/20 0.47
THRB P10828 1/20 0.47
TOP2A P11388 2/20 0.43
TSHR P16473 1/20 0.43
PTGS2 P35354 3/20 0.43
PPARA Q07869 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27579253 0.99 KDM4E (0.54) KDM4EMEN1RECQLKMT2APOLM
SCHEMBL11044984 0.92 POLM (0.58) KDM4EMEN1RECQLKMT2APOLM
SCHEMBL766471 0.89 KMT2A (0.48) KDM4EMEN1RECQLKMT2APOLM
SCHEMBL7285448 0.88 KMT2A (0.57) KDM4EMEN1RECQLKMT2APOLM
SCHEMBL10407328 0.84 KDM4E (0.68) KDM4EMEN1RECQLKMT2APOLM
SCHEMBL28185426 0.84 KDM4E (0.60) KDM4EMEN1RECQLKMT2APOLM
Undecane SCHEMBL17008750 0.83 PPARG (0.58) PPARGTOP2APPARA
SCHEMBL20143639 0.83 KMT2A (0.63) KDM4EMEN1RECQLKMT2APOLM
SCHEMBL1397183 0.83 ALOX15 (0.44) KDM4EMEN1RECQLKMT2AALOX15
SCHEMBL15549264 0.82 KMT2A (0.66) KDM4EMEN1RECQLKMT2APOLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9217919-B2 Photosensitive composition, pattern-forming method using the composition, and resin used in the composition FUJIFILM CORPORATION (JP) 2015-12-22 US disclosed
US-20150338743-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-11-26 US disclosed
US-8895222-B2 Actinic ray-sensitive or radiation-sensitive resin composition and resist film and pattern forming method using the composition FUJIFILM CORPORATION (JP) 2014-11-25 US disclosed
US-8852845-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method using the same, and resin FUJIFILM CORPORATION (JP) 2014-10-07 US disclosed
US-8735048-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the composition and pattern forming method FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
EP-2529276-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE COMPOSITION AND PATTERN FORMING METHOD FUJIFILM Corporation (JP) 2012-12-05 EP disclosed
US-20120301817-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2012-11-29 US disclosed
WO-2011093520-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2011-08-04 WO disclosed
US-20110159433-A1 PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE COMPOSITION, AND RESIN USED IN THE COMPOSITION FUJIFILM CORPORATION (JP) 2011-06-30 US disclosed
EP-2324392-A1 PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE COMPOSITION AND RESIN USED IN THE COMPOSITION FUJIFILM Corporation (JP) 2011-05-25 EP disclosed
US-20100248149-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM AND PATTERN FORMING METHOD USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100183975-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD USING THE SAME, AND RESIN FUJIFILM CORPORATION (JP) 2010-07-22 US disclosed
WO-2010026973-A1 PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE COMPOSITION AND RESIN USED IN THE COMPOSITION FUJIFILM CORPORATION (JP) 2010-03-11 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110159433-A1 PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE COMPOSITION, AND RESIN USED IN THE COMPOSITION SUN2, LCP1, PHYKPL KDM4E 2041/4885MEN1 2467/4885RECQL 243/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.