Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 6/20 | 0.34 |
| ▸ | FLT3 | P36888 | 7/20 | 0.33 |
| ▸ | FLT4 | P35916 | 6/20 | 0.33 |
| ▸ | KDR | P35968 | 5/20 | 0.33 |
| ▸ | MAOB | P27338 | 3/20 | 0.33 |
| ▸ | CNR1 | P21554 | 1/20 | 0.32 |
| ▸ | CNR2 | P34972 | 1/20 | 0.32 |
| ▸ | PDGFRA | P16234 | 1/20 | 0.32 |
| ▸ | FLT1 | P17948 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethane SCHEMBL28745541 | 0.74 | APP (0.44) | MAOACNR1CNR2 | |
| SCHEMBL27640874 | 0.69 | MAOB (0.42) | MAOAMAOB | |
| SCHEMBL28161049 | 0.65 | CNR1 (0.38) | MAOBCNR1CNR2 | |
| SCHEMBL4415372 | 0.64 | VDR (0.41) | CNR1CNR2 | |
| SCHEMBL2292650 | 0.63 | TRPA1 (0.32) | CNR1CNR2 | |
| SCHEMBL27702538 | 0.62 | SLC5A1 (0.35) | CNR1CNR2 | |
| SCHEMBL8976030 | 0.62 | HSD17B1 (0.44) | — | |
| SCHEMBL17837970 | 0.59 | ACLY (0.35) | MAOACNR1CNR2 | |
| SCHEMBL23923588 | 0.59 | HTR2A (0.56) | — | |
| SCHEMBL23940041 | 0.59 | HTR2A (0.56) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10168617-B2 | Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-01-01 | — | — | US | disclosed |
| US-10156787-B2 | Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-12-18 | — | — | US | disclosed |
| US-20170285473-A1 | COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, METHOD FOR FORMING INTERLAYER INSULATING FILM PATTERN, AND DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170285472-A1 | COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, METHOD FOR FORMING INTERLAYER INSULATING FILM PATTERN, AND DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |