SCHEMBL19600588

SCHEMBL19600588

COCc1c(C)c(C)cc(CCO)c1O

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 1/20 0.36
HSD17B10 Q99714 1/20 0.36
PRKCE Q02156 3/20 0.36
MYLK Q15746 2/20 0.36
MEN1 O00255 1/20 0.36
ALDH1A1 P00352 1/20 0.36
PRKCG P05129 1/20 0.36
MAPT P10636 1/20 0.36
PRKCA P17252 1/20 0.36
APEX1 P27695 1/20 0.36
RECQL P46063 1/20 0.36
KMT2A Q03164 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
IGF1R P08069 1/20 0.36
SRC P12931 1/20 0.36
AXL P30530 1/20 0.36
PTK2 Q05397 1/20 0.36
AURKB Q96GD4 1/20 0.36
ALK Q9UM73 1/20 0.36
ALOX5 P09917 4/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10114746 0.77 PRKCE (0.43) HPGDHSD17B10PRKCEMYLKMEN1
SCHEMBL10114775 0.75 PRKCE (0.44) HPGDPRKCEMYLKMEN1ALDH1A1
SCHEMBL14255408 0.75 PRKCE (0.44) HPGDHSD17B10PRKCEMYLKMEN1
SCHEMBL19600585 0.75 SHBG (0.49) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL16850504 0.74 IGF1R (0.42) HPGDHSD17B10PRKCEMYLKMEN1
SCHEMBL12736232 0.74 NPSR1 (0.41) HPGDHSD17B10PRKCEMYLKMEN1
SCHEMBL19600596 0.74 PRKCE (0.43) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL30630953 0.74 PRKCE (0.43) HPGDHSD17B10PRKCEMYLKMEN1
SCHEMBL12418952 0.73 AMY1A (0.46) HPGDHSD17B10PRKCEMYLKMEN1
SCHEMBL19600593 0.73 AMY1A (0.46) HPGDHSD17B10PRKCEMYLKMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed