SCHEMBL19749876

SCHEMBL19749876

NC(=O)c1cc(NC(=O)c2ccccc2O)ccc1O

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALOX15 P16050 4/20 0.66
▸ MEN1 O00255 4/20 0.65
▸ KMT2A Q03164 4/20 0.65
▸ NPC1 O15118 2/20 0.65
▸ RAB9A P51151 2/20 0.65
▸ LMNA P02545 3/20 0.63
▸ HSD17B10 Q99714 3/20 0.62
▸ KDM4E B2RXH2 3/20 0.62
▸ TP53 P04637 2/20 0.62
▸ HTT P42858 2/20 0.62
▸ HPGD P15428 2/20 0.62
▸ PLAU P00749 2/20 0.61
▸ F2 P00734 1/20 0.61
▸ F10 P00742 1/20 0.61
▸ PLG P00747 1/20 0.61
▸ PLAT P00750 1/20 0.61
▸ POLB P06746 2/20 0.59
▸ NFKB1 P19838 1/20 0.59
▸ NFKB2 Q00653 1/20 0.59
▸ RELA Q04206 1/20 0.59

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10763914 0.85 KMT2A (0.69) ALOX15MEN1KMT2ANPC1RAB9A
Salicylanilide SCHEMBL6152522 0.83 MEN1 (0.83) ALOX15MEN1KMT2ANPC1RAB9A
SCHEMBL18327174 0.82 LMNA (0.89) ALOX15MEN1KMT2ANPC1RAB9A
SCHEMBL23817098 0.81 AKR1C3 (0.57) MEN1KMT2AHSD17B10KDM4EPLAU
SCHEMBL18327173 0.81 MEN1 (0.79) ALOX15MEN1KMT2ANPC1RAB9A
SCHEMBL11789164 0.81 MEN1 (0.62) ALOX15MEN1KMT2ANPC1RAB9A
SCHEMBL11786428 0.81 FADS1 (0.68) ALOX15MEN1KMT2ANPC1RAB9A
SCHEMBL11788972 0.78 LMNA (0.64) ALOX15MEN1KMT2ANPC1RAB9A
SCHEMBL551783 0.78 SMN1; SMN2 (0.54) MEN1KMT2ANPC1RAB9ALMNA
SCHEMBL6810850 0.78 LMNA (0.74) ALOX15MEN1KMT2ANPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9868751-B2 Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same SAMSUNG SDI CO., LTD. (KR) 2018-01-16 — — US disclosed
US-9850390-B2 Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same SAMSUNG SDI CO., LTD. (KR) 2017-12-26 — — US disclosed
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