SCHEMBL19822470

SCHEMBL19822470

C=CCNC(=S)NCCC[Si](OC)(OC)OC

nearest known ligand 0.53

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.44
GAA P10253 6/20 0.40
ALDH1A1 P00352 5/20 0.40
POLB P06746 1/20 0.40
TSHR P16473 1/20 0.37
ALOX12 P18054 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
LMNA P02545 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19827963 0.86 GAA (0.47) KMT2AGAAALDH1A1LMNA
SCHEMBL28921712 0.84 KMT2A (0.37) KMT2AGAAALDH1A1TSHRLMNA
SCHEMBL19822463 0.81 ALDH1A1 (0.38) KMT2AGAAALDH1A1ALOX12NPSR1
SCHEMBL15833819 0.80 PKM (0.40) KMT2ATSHRNPSR1LMNA
SCHEMBL19822480 0.79 ALDH1A1 (0.50) KMT2AGAAALDH1A1
SCHEMBL19822468 0.79 QPCT (0.44) KMT2AGAAALDH1A1LMNA
SCHEMBL19822469 0.79 MEN1 (0.47) KMT2AGAAALDH1A1ALOX12NPSR1
SCHEMBL4466119 0.78 CA1 (0.43) KMT2AGAAALDH1A1POLBLMNA
SCHEMBL11336151 0.77 FAAH (0.46) KMT2AGAAALDH1A1TSHRLMNA
SCHEMBL290374 0.77 GAA (0.32) KMT2AGAAALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed