SCHEMBL19822480

SCHEMBL19822480

CCNC(=S)NCCC[Si](OC)(OC)OC

nearest known ligand 0.50

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.50
CYP3A4 P08684 1/20 0.50
HRH4 Q9H3N8 2/20 0.42
GAA P10253 1/20 0.41
HRH2 P25021 1/20 0.41
MTNR1A P48039 2/20 0.40
MTNR1B P49286 2/20 0.40
MEN1 O00255 1/20 0.37
PABPC1 P11940 1/20 0.37
KMT2A Q03164 1/20 0.37
KDM4A O75164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19827963 0.92 GAA (0.47) ALDH1A1CYP3A4GAAMEN1PABPC1
SCHEMBL19822468 0.89 QPCT (0.44) ALDH1A1HRH4GAAHRH2MEN1
SCHEMBL19822469 0.89 MEN1 (0.47) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL4459433 0.82 LMNA (0.45) ALDH1A1HRH4GAAHRH2MTNR1A
SCHEMBL19822464 0.82 SMN1; SMN2 (0.39) ALDH1A1HRH4GAAHRH2MEN1
SCHEMBL19822479 0.80 ALDH1A1 (0.38) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL4466119 0.80 CA1 (0.43) ALDH1A1GAAKMT2A
SCHEMBL19822477 0.80 ALDH1A1 (0.38) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19822484 0.79 ALDH1A1 (0.37) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19822470 0.79 KMT2A (0.44) ALDH1A1GAAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed