SCHEMBL19822468

SCHEMBL19822468

CCCNC(=S)NCCC[Si](OC)(OC)OC

nearest known ligand 0.44

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
QPCT Q16769 1/20 0.44
HRH4 Q9H3N8 1/20 0.42
ALDH1A1 P00352 1/20 0.41
GAA P10253 1/20 0.41
HRH2 P25021 1/20 0.41
MEN1 O00255 1/20 0.40
PABPC1 P11940 1/20 0.40
KMT2A Q03164 1/20 0.40
LMNA P02545 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19822469 0.92 MEN1 (0.47) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19827963 0.92 GAA (0.47) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19822480 0.89 ALDH1A1 (0.50) HRH4ALDH1A1GAAHRH2MEN1
SCHEMBL10456482 0.83 QPCT (0.43) QPCTHRH4ALDH1A1GAAHRH2
SCHEMBL4459433 0.82 LMNA (0.45) QPCTHRH4ALDH1A1GAAHRH2
SCHEMBL19822464 0.82 SMN1; SMN2 (0.39) HRH4ALDH1A1GAAHRH2MEN1
SCHEMBL10557593 0.81 EPHX1 (0.57) MEN1KMT2ALMNA
SCHEMBL19822477 0.80 ALDH1A1 (0.38) QPCTALDH1A1GAAMEN1PABPC1
SCHEMBL19822479 0.80 ALDH1A1 (0.38) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL4466119 0.80 CA1 (0.43) ALDH1A1GAAKMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed